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AQ1541CY-S4-33-TR 参数 Datasheet PDF下载

AQ1541CY-S4-33-TR图片预览
型号: AQ1541CY-S4-33-TR
PDF下载: 下载PDF文件 查看货源
内容描述: 低压差1安培稳压器具有使能功能 [Low Dropout 1 Amp Voltage Regulator with Enable Function]
分类和应用: 稳压器
文件页数/大小: 10 页 / 665 K
品牌: ACUTECH [ ACUTECHNOLOGY SEMICONDUCTOR ]
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Acutechnology Semiconductor Inc.  
AQ1541  
5. Protection Diodes  
Unlike older regulators, the AQ1541 family does not need any protection diodes between  
the adjustment pin and output or from the output to the input to prevent over-stressing the  
die. Internal resistors are limiting the internal current paths on the adjustment pin.  
Therefore, even with capacitors on the adjustment pin, no protection diode is needed to  
ensure device safety under short circuit conditions. External diodes between the input and  
output are not usually needed. Only if high value output capacitors are used (> 1000uF)  
and the input is instantaneously shorted to ground, can damage occur.  
6. Thermal Considerations  
When an integrated circuit operates with an appreciable current, its junction temperature is  
elevated. It is important to quantify its thermal limits in order to achieve acceptable  
performance and reliability. This limit is determined by summing the individual parts  
consisting of a series of temperature rises from the semiconductor junction to the operating  
environment. The heat generated at the device junction flows through the die to the die  
attach pad, through the lead frame to the surrounding case material, to the printed circuit  
board, and eventually to the ambient environment.  
The AQ1541 regulators have internal thermal shutdown to protect the device from over-  
heating. Under all possible operating conditions, the junction temperature of the AQ1541  
must be lower than 125°C. A heatsink may be required depending on the maximum power  
dissipation and maximum ambient temperature of the application.  
To determine if a heatsink is needed, the power dissipated by the regulator, PD, must be  
calculated:  
PD= (VIN-VOUT) IL  
where the IL is the load current.  
The next parameter which must be calculated is the maximum allowable temperature rise,  
T(max):  
T(max)=TJ(max)-TA(max)  
where TJ(max) is the maximum allowable junction temperature (125°C), and TA(max) is the  
maximum ambient temperature which will be encountered in the application.  
Using the calculated values for T(max) and PD, the maximum allowable value for the  
junction to ambient thermal resistance (θJA) can be calculated:  
θJA=T(max)/ PD  
If the maximum allowable value for θJA is found to be greater than the junction to ambient  
thermal resistance for the package used, no heatsink is needed since the package alone will  
dissipate enough heat to satisfy these requirements.  
www.acutechnology.com  
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Rev. 2.2 September 13, 2005  
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