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ACT88430QJ101-T 参数 Datasheet PDF下载

ACT88430QJ101-T图片预览
型号: ACT88430QJ101-T
PDF下载: 下载PDF文件 查看货源
内容描述: [Advanced PMU for Microcontrollers and Solid State Drive Applications]
分类和应用: 微控制器
文件页数/大小: 42 页 / 1108 K
品牌: ACTIVE-SEMI [ ACTIVE-SEMI, INC ]
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ACT88430QJ-T  
Rev 1.0, 24-Oct-2018  
3. Place the LDO input capacitors close to their input  
pins. Connect their ground pins into the ground  
plane that connects the IC’s exposed pad.  
Output Capacitor Selection  
Each LDO requires a high quality, low-ESR, ceramic  
output capacitor. A 1uF is typically suitable, but this  
value can be increased without limit. The input capacitor  
is should be a X5R, X7R, or similar dielectric.  
4. The input capacitor and output capacitor grounds  
should be connected as close together as possible,  
with short, direct, and wide traces.  
LDO1 Load Switch Mode  
LDO1 has an option to be used as a load switch. This  
option is only accessible via factory I2C bits and requires  
a custom CMI. When in load switch mode, LDO1 still  
retains overcurrent protection. Overvoltage and  
undervoltage protection are disabled.  
5. Connect the PGNDx ground pins and the AGND  
ground pin directly to the exposed pad under the IC.  
The AGND ground plane should be routed  
separately from the other ground planes and only  
connect to the main ground plane under the IC at  
the AGND pin.  
The load switch mode softstart times are the same as  
the LDO mode times.  
6. Connect the VIO_IN input capacitor to the AGND  
ground pin.  
The following table shows the load switch Current limit  
settings  
7. Connect the VIN input capacitor to the AGND  
ground pin.  
Table 7: Load Switch Current Limit Settings  
8. Remember that all open drain outputs need pullup  
resistors.  
ILIM_SET<1:0>  
ILIM(mA)  
1415  
1503  
1626  
1904  
0
1
2
3
9. Connect the exposed pad directly the top layer  
ground plane. Connect the top layer ground plane  
to both internal ground planes and the PCB  
backside ground plane with thermal vias. Provide  
ground plane routing on multiple layers that allows  
the IC’s heat to flow into the PCB and then spread  
radially from the IC. Avoid cutting the ground planes  
and adding vias that restrict the radial flow of heat  
of operating conditions, and are relatively  
insensitive to layout considerations.  
Both Overvoltage and Undervoltage functionality are  
disabled.  
The LDO1 POK is functional in Load Switch mode. The  
POK signal is asserted when the switch is enabled and  
is not in current limit.  
PC board layout guidance  
Proper parts placement and PCB layout are critical to  
the operation of switching power supplies. Follow the  
following layout guidelines when designing the  
ACT88430 PCB. Refer to the Active-Semi ACT88430  
Evaluation Kits for layout examples  
1. Place the buck input capacitors as close as possible  
to the IC. Connect the capacitors directly to the  
corresponding VIN_Bx input pin and PGNDx power  
ground pin. Avoid the use of vias if possible.  
2. Minimize the switch node trace length between  
each SW_Bx pin and the inductor. Avoid routing  
sensitive analog signals near these high frequency,  
high dV/dt traces.  
Innovative PowerTM  
www.active-semi.com  
Copyright © 2016-2018 Active-Semi, Inc.  
ActiveSwitcherTM is a trademark of Active-Semi.  
I2CTM is a trademark of NXP  
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