ACT2803
Rev 1, May-12-2016
APPLICATIONS INFORMATION
2. Place the decoupling ceramic capacitor as
close to BAT pin as possible. Use different
capacitance combination to get better EMI
performance.
3. Place the decoupling ceramic capacitors close
to VIN pin, VOUT pin, and BAT pin.
4. Use copper plane for power GND for best heat
dissipation and noise immunity.
5. Connect battery with the sequence of BATN-
>BATP->BATC.
6. Use Kevin sense from sense resistors to CSP
and CSN pins, and the sense resistor from
BATS and BATP pins.
7. SW pad is a noisy node switching. It should be
isolated away from the rest of circuit for good
EMI and low noise operation.
8. Thermal pad is connected to GND layer through
vias. PGND and AGND should be single-point
connected.
9. RC snubber and external Schottky diode across
SW to PGND can be added as needed for
reducing SW spike and better EMI
performance.
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