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A10V10B-1CQ84M 参数 Datasheet PDF下载

A10V10B-1CQ84M图片预览
型号: A10V10B-1CQ84M
PDF下载: 下载PDF文件 查看货源
内容描述: ACT 1系列FPGA [ACT 1 Series FPGAs]
分类和应用:
文件页数/大小: 24 页 / 163 K
品牌: ACTEL [ Actel Corporation ]
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A C T  
1 S e r i e s F P G A s  
P a c k a g e T h e r m a l C h a r a c t e r i s t i c s  
A sample calculation of the maximum power dissipation for  
an 84-pin plastic leaded chip carrier at commercial  
temperature is as follows:  
The device junction to case thermal characteristics is  
θjc, and the junction to ambient air characteristics is θja. The  
thermal characteristics for θja are shown with two different  
air flow rates. Maximum junction temperature is 150°C.  
Max junction temp.C) – Max commercial temp.C)  
150°C – 70°C  
37°C W  
------------------------------------------------------------------------------------------------------------------------------------------------- = ---------------------------------- = 2.2 W  
θjaC W)  
θja  
Still Air  
θja  
300 ft/min  
Package Type  
Pin Count  
θjc  
Units  
44  
68  
84  
15  
13  
12  
45  
38  
37  
35  
29  
28  
°C/W  
°C/W  
°C/W  
Plastic J-Leaded Chip Carrier  
Plastic Quad Flatpack  
100  
80  
13  
12  
8
48  
43  
33  
40  
40  
35  
20  
30  
°C/W  
°C/W  
°C/W  
°C/W  
Very Thin (1.0 mm) Quad Flatpack  
Ceramic Pin Grid Array  
84  
Ceramic Quad Flatpack  
84  
5
G e n e r a l P o w e r E q u a t i o n  
The power due to standby current is typically a small  
component of the overall power. Standby power is calculated  
below for commercial, worst case conditions.  
P = [ICCstandby + ICCactive] * V + IOL * V * N + IOH  
*
CC  
OL  
(V – V ) * M  
CC  
OH  
ICC  
V
Power  
CC  
Where:  
3 mA  
5.25 V  
5.25 V  
3.60 V  
3.30 V  
15.75 mW (max)  
5.25 mW (typ)  
2.70 mW (max)  
0.99 mW (typ)  
ICCstandby is the current flowing when no inputs or  
outputs are changing.  
1 mA  
0.75 mA  
0.30 mA  
ICCactive is the current flowing due to CMOS switching.  
IOL, IOH are TTL sink/source currents.  
Ac t iv e P o w e r C o m p o n e n t  
V , VOH are TTL level output voltages.  
OL  
N equals the number of outputs driving TTL loads to  
Power dissipation in CMOS devices is usually dominated by  
the active (dynamic) power dissipation. This component is  
frequency dependent, a function of the logic and the  
V .  
OL  
M equals the number of outputs driving TTL loads to  
V .  
external I/O. Active power dissipation results from charging  
internal chip capacitances of the interconnect,  
unprogrammed antifuses, module inputs, and module  
outputs, plus external capacitance due to PC board traces  
and load device inputs. An additional component of the active  
power dissipation is the totem-pole current in CMOS  
transistor pairs. The net effect can be associated with an  
equivalent capacitance that can be combined with frequency  
and voltage to represent active power dissipation.  
OH  
An accurate determination of N and M is problematical  
because their values depend on the family type, design  
details, and on the system I/O. The power can be divided into  
two components: static and active.  
S t a t ic P o w e r C o m p o n e n t  
Actel FPGAs have small static power components that result  
in lower power dissipation than PALs or PLDs. By integrating  
multiple PALs/PLDs into one FPGA, an even greater  
reduction in board-level power dissipation can be achieved.  
1 -2 8 9  
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