MIL-PRF-38535K
INDEX
PARAGRAPH
A.3.6.4
Manufacturer's identification
Manufacturer's internal instructions for internal visual
inspection
A.4.8.1.3.6
3.3.1
Manufacturer's review system
Manufacturer's review system
Manufacturing verification
Marking
G.3.2
B.3.4
5.2
Marking
F.3.1
Marking location and sequence
Marking location and sequence
Marking of container
3.6.7
A.3.6.9
A.5.2.2
Marking of microcircuits
Marking of microcircuits
Marking on container
Marking on container
A.3.6
3.6.9
A.3.6.10
A.3.6.11
Marking option for controlled storage of class level B
Marking option for qualification or quality conformance
inspection (QCI)
A.3.6.12
J.3.1
Mask requirements (when applicable)
Metal package isolation test for class level S devices
Metallization thickness
A.4.1.1.1
A.3.5.5.1
A.3.5.2
Metals
Microcircuit
A.3.1.3.4
A.3.5.6.3
A.3.1.3.13
A.4.5.4.1.1
6.4.4.3
Microcircuit finishes
Microcircuit group
Microcircuit group assignments
Microcircuit module
Microcircuit module
A.3.1.3.5
6.4.1
Microelectronics
Microelectronics
A.3.1.3.1
3.6.2.2.1
A.3.6.2.1
A.3.1.3.31
6.4.4.2
Military designator
Military designator
Military operating temperature range
Monolithic microcircuit
Monolithic microcircuit (or integrated circuit)
Multichip microcircuit
A.3.1.3.4.3
6.4.4.1
Multichip microcircuit
A.3.1.3.4.1
D.4.2.4
A.4.5.8
Multiple criteria
Nonconformance
Nondestructive bond pull test for class level S devices
Nondestructive tests
A.4.6.5
A.4.3.2.3
2.3
Non-Government publications
Non-Government publications
Non-Government publications
J.2.3
A.2.3
194
ACTEL [ Actel Corporation ]
