MIL-PRF-38535K
APPENDIX G
G.3.4.4 Package change. Changes in the package qualification to be evaluated by the TRB shall include, but not
be limited to, changes in the following areas:
a. Vendor.
b. External dimensions.
c. Cavity dimensions.
d. Number of leads or terminals.
e. Lead or terminal dimensions (length times width or diameter).
f. Lead or terminal base material.
g. Lead or terminal plating material.
h. Lead or terminal plating thickness (range of).
i. Body material.
j. Body plating material.
k. Body plating thickness (range of).
l. Die pad material.
m. Die pad plating.
n. Die pad plating thickness (range of).
o. Lid material.
p. Lid plating materials (range of).
q. Lid plating thickness (range of).
r. Lid seal (preform) material.
s. Lid glass seal material.
t. Lead glass seal material.
u. Lead glass seal diameter (range of).
v. Leads or terminals spacing.
w. Lead configuration (e.g., J-lead, gull-wing).
x. Die size.
y. Device marking process.
z. Lead attachment.
G.3.4.5 Test facility change. Changes in the test facility to be evaluated by the TRB shall include, but not be
limited to, changes in the following areas:
a. Implementation procedures for internal visual and other test methods.
b. Testing flow.
c. Test facility (with laboratory suitability) move from one facility or building to another.
d. Sample plans (quantity and acceptance numbers).
e. Test procedures (including test vector generation).
f. Lot formation.
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ACTEL [ Actel Corporation ]
