MIL-PRF-38535K
f. The overall control of the process are under the auspices of a TRB which is established by the manufacturer. The
TRB is solely responsible for the QML flow that has been certified and qualified.
g. For RHA devices, procedures and requirements are integrated into this specification for establishing and
demonstrating a RHACL for the technology. Many device-oriented tests can be reduced or eliminated when
correlation data for models and test structures have been established by the TRB. The main concern in the RHA
community is whether the device specification accurately describes the device performance in the radiation
environment specified. Until such models and test structures are developed, some actual device radiation testing will
be required.
h. Appendix B to this specification defines an implementation transition approach which may be used for space or other
critical environment applications.
6.6 Additional reference documents. The following documents are not directly referenced herein but should be used as
guidelines.
MIL-HDBK-339
MIL-HDBK-814
-
-
Custom Large Scale Integrated Circuit Development and Acquisition for Space Vehicles.
Ionizing Dose and Neutron Hardness Assurance Guidelines for Microcircuits and
Semiconductor Devices.
MIL-HDBK-815
MIL-HDBK-816
MIL-HDBK-817
-
-
-
Dose-Rate Hardness Assurance Guidelines.
Guidelines for Developing Radiation Hardness Assurance Device Specifications.
System Development Radiation Hardness Assurance.
(Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
ASTM INTERNATIONAL (ASTM)
ASTM B487
ASTM B567
-
-
Standard Test Method for Measurement of Metal and Oxide Coating Thickness by
Microscopical Examination of a Cross Section.
Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method.
(Copies of these documents are available online at http://www.astm.org/ or from ASTM International, 100 Barr Harbor Drive,
P.O. Box C700, West Conshohocken, PA 19428-2959.)
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JESD541
JEP95
JESD16
-
-
-
Packaging Material Standards for ESD Sensitive Items.
JEDEC Registered and Standard Outlines for Solid State and Related Products.
Assessment of Average Outgoing Quality Levels in Parts Per Million (PPM).
(Copies of these documents are available online at http://www.jedec.org or from JEDEC – Solid State Technology
Association, 3103 North 10th Street, Suite 240–S, Arlington, VA 22201-2107.)
41
ACTEL [ Actel Corporation ]
