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5962-0421901QUA 参数 Datasheet PDF下载

5962-0421901QUA图片预览
型号: 5962-0421901QUA
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, CMOS, CPGA624, CERAMIC, CGA-624]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX G  
G.3 REQUIREMENTS. The requirements of the microcircuits are classified in the generic qualification flow  
diagram (see figure G-1).  
G.3.1 QM program. A quality management program shall be developed and implemented by the manufacturer  
and documented in the QM plan (see G.3.3 herein). Also, the manufacturer shall have a self-assessment program  
with an evaluation system similar to that posed by the Malcolm Baldridge National Quality Award, and the results of  
this assessment shall be made available for review. The manufacturer is encouraged to apply for the Malcolm  
Baldridge National Quality Award within 5 years of initial request for QML status.  
G.3.2 Manufacturer's review system. The manufacturer’s review system, known as the TRB, is responsible for  
development of the QM plan, maintenance of all certified and qualified processes, process change control (see  
3.3.4), reliability data analysis, failure analysis, corrective actions, QML microcircuit recall procedures, and  
qualification status of the technology.  
G.3.2.1 Organizational structure. The manufacturer's TRB should insure communication is established and  
maintained among representatives from device design, technology development, wafer fabrication, assembly, testing,  
quality assurance and third party organizations. Records of the TRB deliberations and decisions should be  
maintained. These records shall be made available to the qualifying activity (QA). The manufacturer shall submit the  
name(s) and telephone numbers of their TRB systems' contact person(s) to the QA.  
G.3.2.2 TRB duties. The TRB shall keep the QA updated on the status of QML technology and products. The  
TRB should have a methodology in place for assessing the current status of the quality and reliability of its  
microcircuits by review of the Statistical Process Control (SPC) procedures and QM status of the manufacturer's  
process technology, reliability test data (e.g., parametric monitor (PM), Technology Characterization Vehicle (TCV),  
Standard Evaluation Circuit (SEC) and device), and the Failure Analysis (FA) results of burn-in/screening failures and  
board/assembly failures and field returns, as applicable. A method or procedure to verify correlation between test  
structures and actual product should be approved by the TRB. The TRB shall maintain records, available for QA  
review, of conditions found and the action taken. The TRB is required to report periodically to the QA on the status of  
the QML technology and products (see G.3.2.3 herein). The TRB should also address the impact of key  
managerial/TRB personnel changes and business plans in order to evaluate any impact they may have on the QML  
system.  
When the reliability data indicates corrective action is required, the TRB should determine and implement the  
appropriate action in a timely manner. The SEC and TCV (see G.3.3f herein) data are to be used as a tool for  
monitoring the quality and reliability of the manufacturer's line and do not automatically disqualify a manufacturer  
when trends or limits require corrective action.  
When reliability of shipped microcircuits is called into question, the TRB should provide evaluation and corrective  
action and prompt notification to the QA to preserve the manufacturer's qualified status and assure that defective  
product is not shipped.  
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