MIL-PRF-38535K
APPENDIX G
(6) Preconditioning (board assembly/rework simulation.)
(7) Wafer (lot) acceptance.
(8) Internal visual.
(9) Nondestructive bond pull (NDBP).
(10) Scanning electron microscope (SEM) or nondestructive SEM.
(11) Life test.
(12) Radiographic inspection.
(13) Radiation testing.
l. Calibration.
m. Retention of qualification.
n. Training.
o. Cleanliness and atmospheric controls.
p. Electrostatic discharge (ESD) sensitivity program.
q. Certification and qualification test plan (see G.3.2.2.1).
r. Process for control of third party activities.
s. Characterization procedures for new technology validation.
G.3.4 Change control procedures. The following paragraphs outline areas of concern where a change may
require action by the manufacturer. All changes to any part of a QML manufacturer's line are to be governed by the
manufacturer's TRB and made available to the QA. All changes should be documented as to the reason for the
change with supporting data taken to support the change, including reliability data as appropriate. The decision as to
the criticality of the change shall be guided by the potential effect of the change on quality, reliability, specified
radiation hardness assurance levels (when applicable), performance and interchangeability of the resulting
microcircuits. For any change that merits consideration for requalification, the TRB should decide if requalification is
needed. Microcircuits should be shipped following a change only upon approval of the TRB. Modifications to
screens and TCI's are allowed but shall be justified, documented, and submitted to the QA. Notification of the change
should be made concurrently to the QA for a period of not less than one year after initial QML listing. Thereafter,
notification should be made in the TRB status reports (see G.3.2.3 herein). The manufacturer may make notification
of this change of product through the Government-Industry Data Exchange Program (GIDEP) using the Product
Change Notice; in any case, the manufacturer should assure that all known acquiring activities are notified. For
major changes to class level “S” microcircuits, the manufacturer’s TRB shall notify the QA who will coordinate with the
space community of changes prior to shipment. The manufacturer shall review all changes for applicability to
previous test optimizations and alternate test methods.
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ACTEL [ Actel Corporation ]
