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5962-0422104QUC 参数 Datasheet PDF下载

5962-0422104QUC图片预览
型号: 5962-0422104QUC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 2000000 Gates, 32256-Cell, CMOS, CQFP256, CERAMIC, QFP-256]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX G  
G.3.3 QM plan. The TRB shall oversee and approve the QM plan consisting of the following activities and  
initiatives, as a minimum:  
a. Quality improvement plan. This plan documents the specific procedures to be followed by the manufacturer  
to assure continuous improvement in quality, and reliability of the process and the product being produced.  
b. Failure analysis program. This program establishes the procedures that a manufacturer self-imposes to  
test and analyze sufficient failed parts to determine each failure category from all stages of manufacturing  
and the field. This program should also identify corrective actions or specify the use of a corrective action  
plan based on the findings of the failure analysis.  
c. SPC plan. A specific plan defining the manufacturer's SPC program, within the manufacturing process, to  
the requirements of EIA557.  
d. Corrective action plan. This plan should specify the specific steps followed by the manufacturer to correct  
any process that is out of control or found to be defective.  
e. Change control program. This program addresses the process by which a manufacturer addresses  
changes to the technology. Further information of areas to be considered critical for change control are  
outlined in G.3.4 herein.  
f. SEC and TCV assessment program. The frequency, testing methods, and criteria for evaluations of the  
SEC or the TCV or both, including correlation of test structures and actual product, are to be determined by  
the TRB based on the manufacturer's assessment of risk. The manufacturer's SEC and TCV evaluation  
plan shall be documented.  
g. Certification and qualification plan. The certification and qualification plan should be defined in appendix H  
including self-assessment and corrective actions.  
h. Retention of data. This program establishes the requirements for data retention (see A.4.8.1.2 as a  
guideline).  
G.3.3.1 QM plan outline. The following should be addressed in the QM plan. Submittal of the QM plan is required  
before the validation (certification) meeting.  
NOTE:  
Many of these items and their associated documentation may be reviewed during the validation.  
a. Index of certified baseline documents. A list of the specification titles, document numbers, and revisions that  
make up the QML program. This is the baseline the manufacturer was certified to at a validation review.  
b. Conversion of customer requirements. A system for converting all customer's requirements into in-house  
requirements. This includes determining if certification and QML coverage exist. The following are both part  
of the QM plan and the manufacturer's conversion system:  
(1) Device specification requirements to Standard Microcircuit Drawing (SMD).  
(2) Controlled design procedures and tools (established geometric, electrical, and reliability design rules).  
(3) Mask generation procedure within the controlled design procedures of G.3.3.1b.(2).  
(4) Wafer fabrication and assembly capabilities baselined.  
(5) Design, mask, fabrication, assembly, and test flows.  
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