MIL-PRF-38535K
APPENDIX F
F.4.5.1 Visual examination of encapsulant. Visual inspection of the applied encapsulant post-cure is required.
Sample size and accept/reject limits shall be documented and determined by the manufacturer, and, at a minimum,
address the following areas:
a. Cracks.
b. Voids.
c. Lack of interfacial adhesion.
d. Poor uniformity.
e. Stress on underlying layers.
f.
Coverage of desired area.
F.4.6 Screening. One hundred percent screening shall be performed in accordance with TM 5004 of
MIL-STD-883, with the following deletions and additions:
F.4.6.1 Optional internal visual. An optional internal visual examination may be performed prior to bump utilizing
applicable criteria within TM 2010 of MIL-STD-883 or manufacturer's internal criteria in order to screen die defects.
Sample size and accept/reject criteria shall be determined and documented by the manufacturer.
F.4.6.2 Internal visual screen. One hundred percent internal visual examination shall be performed prior to
encapsulant utilizing applicable criteria within TM 2010 of MIL-STD-883 to screen die defects. At the manufacturer's
option, bump visual and ILB visual may be combined with this internal visual examination provided 100 percent of the
product is examined.
F.4.6.3 Temperature cycle. One hundred percent temperature cycle shall be performed in accordance with TM
1010 of MIL-STD-883, test condition C.
F.4.6.4 Burn-in. One hundred percent pre, interim, and post burn-in electrical test shall be performed in
accordance with the device specification. One hundred percent burn-in shall be performed in accordance with TM
1015 of MIL-STD-883.
F.4.6.5 Percent defective allowable (PDA) . PDA shall be calculated in accordance with TM 5004 of MIL-STD-883.
F.4.6.6 External visual. One hundred percent external visual examination shall be performed in accordance with
TM 2009 of MIL-STD-883 or manufacturer's applicable external criteria.
F.4.7 Quality conformance inspection (QCI) . QCI shall be performed in accordance with TM 5005 of
MIL-STD-883 with the following deletions and additions:
F.4.7.1 Group A inspection. Group A inspection shall be in accordance with TM 5005 of MIL-STD-883 and the
applicable device specification.
F.4.7.2 Group B inspection. Group B inspection shall be in accordance with the following:
F.4.7.2.1 Resistance to solvents. Resistance to solvents (TM 2015 of MIL-STD-883) shall be performed when ink
marking is utilized. Sample size shall be in accordance with TM 5005 of MIL-STD-883.
F.4.7.2.2 Attachability. Attachability of the outer lead bond shall be assured as documented in the device
specification and shall include sample size and accept/reject limits.
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ACTEL [ Actel Corporation ]
