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5962-0151801QYC 参数 Datasheet PDF下载

5962-0151801QYC图片预览
型号: 5962-0151801QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 32000 Gates, 206MHz, 2880-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX A  
A.4.4.2.6 Approval of other lead finishes. After qualification of one package type with a single lead finish, other  
lead finishes may be approved by submitting a single device type for each additional lead finish in the previously  
approved package family to group B, subgroup 3 and group D, subgroups 1, 3, 5, and 7 tests. Subgroup D-7 testing  
should not be required for hot solder dip over lead finishes B or C (tin-lead, gold plate) which have been qualified on  
the same package family.  
A.4.4.2.7 Approval of other lead material. After the first lead material is qualified with a particular package family,  
the new lead material for the package family can be considered qualified provided the required lead finish tests  
specified (see A.4.4.2.6) with the addition of subgroup D-2, are successfully performed. Subgroup D-6 should be  
completed when the lead frame extends into the die cavity.  
A.4.4.2.8 Electrostatic discharge (ESD) sensitivity. ESD classification testing shall be done in accordance with  
TM 3015 of MIL-STD-883 (The testing procedure defined within JESD22-A114 may be used as an alternate with  
acceptable correlation data.), and the applicable device specification or drawing (see A.3.6.9.2). Devices shall be  
handled in accordance with the manufacturer's in-house control documentation, which shall be maintained by the  
manufacturer. Guidance for device handling is available in JESD625.  
A.4.5 Quality conformance inspection (QCI).  
A.4.5.1 General. Quality conformance inspection shall be conducted in accordance with the applicable  
requirements of groups A, B, C, and D (and E if applicable) as specified herein or TM 5005 (or TM 5010 when  
applicable) of MIL-STD-883, for the specified device class and TM 5007 of MIL-STD-883, when applicable.  
Inspection lot sampling shall be in accordance with appendix D of this specification. Test results shall be recorded by  
inspection lot identification code (see A.3.6.3) for each inspection lot.  
A.4.5.2 Group A inspection. Group A inspection shall be performed on each inspection lot in accordance with  
MIL-STD-883 and shall consist of electrical parameter tests specified for the specified device class. If an inspection  
lot is made up of a collection of class level B splits or class level S inspection sublots, it shall be recombined into an  
inspection lot before the group A inspection sample is taken or a group A inspection sample shall be taken from each  
split or class level S inspection sublot.  
A.4.5.3 Group B inspection. Group B inspection shall be performed in accordance with MIL-STD-883 on each  
inspection lot for each package type and lead finish. As an alternate, except for class level S (at the manufacturer's  
option) group B inspection may be performed on each package type and lead finish in accordance with 3.5.2 of TM  
5005 or 3.4.2.1 of TM 5010 of MIL-STD-883. For class level S, group B, subgroups 1A, 2, 3, and 4 inspections shall  
be performed on each sublot (split) when the manufacturer elects to keep the sublots (splits) separate from each  
other after screen tests are completed. Except as otherwise specified in TM 5005 of MIL-STD-883, samples for this  
inspection shall be completed and fully marked devices from lots which have been subjected to and passed the post  
burn-in +25°C final electrical static tests (subgroup 1). Class level S steady-state life test, subgroup B-5, results shall  
not be used to support class level B shipments.  
A.4.5.4 Group C inspection for class level B only. Group C inspection (die-related tests) shall be in accordance  
with MIL-STD-883 and shall include those tests specified which are performed periodically. Group C shall have been  
completed on product with a die fabrication date code within four calendar quarters prior to the die fabrication date  
code of product being submitted for acceptance. Group C tests are required for devices from each microcircuit group  
(see A.3.1.3.13) in which a manufacturer is supplying product. Group C tests for each microcircuit group shall be  
performed on one inspection lot of the most complex device type available at the time of selection from production  
devices produced on each certified die fabrication line once per calendar year.  
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