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5962-0151801QYC 参数 Datasheet PDF下载

5962-0151801QYC图片预览
型号: 5962-0151801QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 32000 Gates, 206MHz, 2880-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX A  
A.3.4.2 Changes and notification of change to product or quality assurance program. The manufacturer shall be  
responsible for the implementation of any major changes(s) or class 1 changes of the product or quality assurance  
program which may affect performance, quality, reliability, radiation hardness assurance (when specified), ESD class  
or interchangeability (see table A-I). The information needed to support these changes shall include acceptable  
engineering data, quality conformance inspection data, or a test plan sufficient to demonstrate that the changes(s)  
shall not adversely affect performance, quality, reliability, interchangeability, radiation hardness, or electrostatic  
discharge sensitivity and that the product will continue to meet the specification requirements. Notification to the  
acquiring activity of change of product involving devices acquired to any detail specification/drawing/data sheet is  
required for class 1 changes. Class 1 changes are those changes that may affect the performance, quality, reliability,  
or interchangeability of the product. Major changes as defined in table A-I shall, as a minimum, be reviewed to  
determine whether notification to the users is required. The manufacturer shall make this notification to the acquiring  
activity at the time of acceptance of a new order or delivery of an existing order. The manufacturer may make  
notification of this change of product through the GIDEP using the Product Change Notice; in any case the  
manufacturer shall assure that all known acquiring activities for this product are notified.  
A.3.4.2.1 Discontinuation of products. The manufacturer shall have a system that provides notification of product  
discontinuation which comprises date of discontinuation and last time buy opportunity in advance (at least 6 months  
in advance) to the DLA Land and Maritime for purchasing devices.  
A.3.4.3 Screening. All microcircuits to be delivered or submitted for quality conformance in accordance with this  
appendix shall have been subjected to, and passed, all the screening tests detailed in TM 5004 of MIL-STD-883 for  
the type of microcircuit and quality assurance level (device class) specified.  
A.3.4.4 Quality conformance inspection (QCI). Microcircuits shall not be accepted or approved for delivery until  
the inspection lot has passed QCI (see A.4.5).  
A.3.4.5 Wafer lot acceptance. Class level S microcircuits furnished under this appendix shall be products from  
wafer lots that are subjected to and successfully meet the wafer lot acceptance inspections and tests specified in test  
method 5007 of MIL-STD-883 or equivalent procedures approved by the acquiring activity.  
A.3.4.6 Traceability. Traceability shall be provided for all microcircuit quality assurance levels. Each delivered  
microcircuit shall be traceable to the inspection and wafer lot(s) (see A.4.8.1.2).  
A.3.4.6.1 Lot travelers. The manufacturer shall maintain lot travelers to document the completion of each required  
processing step from wafer diffusion for class level S (and class level B radiation hardened devices) and beginning  
with assembly for class level B with wafer lot identification through microcircuit assembly and screening test.  
Travelers shall provide space for those items specified in A.4.8.1.3.7. The lot travelers shall provide traceability to all  
prior processing steps and shall be identifiable through assembly and acceptance testing and shall be monitored by  
the manufacturer's quality control organization.  
A.3.4.7 Government source inspection. Government source inspection is required as detailed in the contract or  
order.  
A.3.5 Design and construction. Microcircuit design and construction shall be in accordance with all the  
requirements specified herein and in the device specification or drawing.  
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