MIL-PRF-38535K
APPENDIX A
A.3.4.2 Changes and notification of change to product or quality assurance program. The manufacturer shall be
responsible for the implementation of any major changes(s) or class 1 changes of the product or quality assurance
program which may affect performance, quality, reliability, radiation hardness assurance (when specified), ESD class
or interchangeability (see table A-I). The information needed to support these changes shall include acceptable
engineering data, quality conformance inspection data, or a test plan sufficient to demonstrate that the changes(s)
shall not adversely affect performance, quality, reliability, interchangeability, radiation hardness, or electrostatic
discharge sensitivity and that the product will continue to meet the specification requirements. Notification to the
acquiring activity of change of product involving devices acquired to any detail specification/drawing/data sheet is
required for class 1 changes. Class 1 changes are those changes that may affect the performance, quality, reliability,
or interchangeability of the product. Major changes as defined in table A-I shall, as a minimum, be reviewed to
determine whether notification to the users is required. The manufacturer shall make this notification to the acquiring
activity at the time of acceptance of a new order or delivery of an existing order. The manufacturer may make
notification of this change of product through the GIDEP using the Product Change Notice; in any case the
manufacturer shall assure that all known acquiring activities for this product are notified.
A.3.4.2.1 Discontinuation of products. The manufacturer shall have a system that provides notification of product
discontinuation which comprises date of discontinuation and last time buy opportunity in advance (at least 6 months
in advance) to the DLA Land and Maritime for purchasing devices.
A.3.4.3 Screening. All microcircuits to be delivered or submitted for quality conformance in accordance with this
appendix shall have been subjected to, and passed, all the screening tests detailed in TM 5004 of MIL-STD-883 for
the type of microcircuit and quality assurance level (device class) specified.
A.3.4.4 Quality conformance inspection (QCI). Microcircuits shall not be accepted or approved for delivery until
the inspection lot has passed QCI (see A.4.5).
A.3.4.5 Wafer lot acceptance. Class level S microcircuits furnished under this appendix shall be products from
wafer lots that are subjected to and successfully meet the wafer lot acceptance inspections and tests specified in test
method 5007 of MIL-STD-883 or equivalent procedures approved by the acquiring activity.
A.3.4.6 Traceability. Traceability shall be provided for all microcircuit quality assurance levels. Each delivered
microcircuit shall be traceable to the inspection and wafer lot(s) (see A.4.8.1.2).
A.3.4.6.1 Lot travelers. The manufacturer shall maintain lot travelers to document the completion of each required
processing step from wafer diffusion for class level S (and class level B radiation hardened devices) and beginning
with assembly for class level B with wafer lot identification through microcircuit assembly and screening test.
Travelers shall provide space for those items specified in A.4.8.1.3.7. The lot travelers shall provide traceability to all
prior processing steps and shall be identifiable through assembly and acceptance testing and shall be monitored by
the manufacturer's quality control organization.
A.3.4.7 Government source inspection. Government source inspection is required as detailed in the contract or
order.
A.3.5 Design and construction. Microcircuit design and construction shall be in accordance with all the
requirements specified herein and in the device specification or drawing.
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