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5962-0151801QYC 参数 Datasheet PDF下载

5962-0151801QYC图片预览
型号: 5962-0151801QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 32000 Gates, 206MHz, 2880-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX B  
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)  
JESD57 - Test Procedures for the Measurement of Single Event Effects in Semiconductor Devices from Heavy Ion  
Irradiation.  
(Copies of these documents are available online at http://www.jedec.org or from JEDEC – Solid State Technology Association,  
3103 North 10th Street, Suite 240–S, Arlington, VA 22201-2107.)  
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the  
documents. These documents also may be available in or through libraries or other informational services.)  
B.2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this  
document and the references cited herein(except for related specification sheets), the text of this document takes precedence.  
Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.  
B.3 REQUIREMENTS  
B.3.1 General. Microcircuits supplied to this appendix shall be manufactured and tested in accordance with the approved DLA  
qualifying activity (QA) baselines and the applicable requirements specified herein. Upon approval from the Technology Review  
Board (TRB) and the qualifying activity (QA), screening and TCI tests may be modified/optimized for qualified manufacturer listing  
(QML) class V or class Y (class level S) product, provided substantiating data is submitted to demonstrate that the manufacturer has  
a defined capability on the manufacturing line which is under control, repeatable and reliable to and produces product that that meets  
the intent of the original requirements. These changes cannot affect any thermal, mechanical or electrical parameters, which affect  
form, fit, function or radiation hardness assurance level (when applicable) of the device, defined within the device specification or  
standard microcircuit drawing (SMD). The space community (e.g., DTRA, NASA, NRO, and AFSMC) and the customer shall be  
notified of major changes to the manufacturer's quality management (QM) plan. Any optimization proposed by the manufacturer  
must be presented to the qualifying activity and coordinated with the space community with accompanying supporting data to validate  
the proposed change. The optimization must be approved by the QA in writing prior to implementation. For class V and class Y  
(class level S) product marked with RHA designator required to meet appendix C and table C-I group E tests.  
B.3.1.1 Acquiring activity. When specified by the acquisition document (purchase order), the acquiring activity may:  
a. Require prior notification of major changes to the baselined processes, procedures, or testing.  
b. Require independent verification of wafers (unprobed) or packaged devices (technology characterization vehicle (TCV),  
standard evaluation circuit (SEC), or actual devices) by original equipment manufacturer’s (OEM's) or Government  
agencies.  
c. Request screening and TCI summary data is delivered with the devices.  
B.3.2 Conflicting requirements. In the event of conflict between the requirements of this appendix and other referenced  
documents, the order of precedence shall be as follows:  
a. The acquisition document (order).  
b. Applicable device specification.  
c. This appendix.  
d. MIL-PRF-38535.  
e. Specifications, standards, and other documents referenced in 2.1 of MIL-PRF-38535.  
NOTE: The acquisition document may specify additional requirements, but shall not reduce or waive any requirements herein.  
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