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5962-0151801QYC 参数 Datasheet PDF下载

5962-0151801QYC图片预览
型号: 5962-0151801QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 32000 Gates, 206MHz, 2880-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX A  
A.4.8.1.1.10 Failure and defect analysis and feedback. The procedures for identification, handling, and analysis of  
failed or defective devices and for dissemination of analysis data shall be documented, including the procedure for  
informing the qualifying activity of analysis results, when applicable.  
A.4.8.1.1.11 Corrective action and evaluation. The procedure and responsibility for decisions regarding the  
necessity for corrective action as a result of failure or defect analysis, and for evaluation and approval of proposed  
corrective actions, shall be documented. If the procedure for evaluation and approval of changes proposed for other  
reasons, such as cost reduction or product improvement, differs from the above, it shall also be documented.  
A.4.8.1.1.12 Incoming, in-process, and outgoing inventory control. The methods and procedures shall be  
documented which are used to control storage and handling of incoming materials, work in-process, and warehoused  
and outgoing product in order to (a) achieve such factors as age control of limited-life materials; and (b) prevent  
inadvertent mixing of conforming and nonconforming materials, work, or finished product. Tests and inspections  
performed by the manufacturers on acquired materials and supplies shall include verification of chemical, physical,  
and functional characteristics required by manufacturer drawings and specifications. Procedures shall be prepared  
and maintained for controlling the receipt of acquired materials and supplies. The procedures shall provide the  
following:  
a. Withholding received materials or supplies from use pending completion of the required inspection or tests, or  
the receipt of necessary reports.  
b. Segregation and identification of nonconforming materials and supplies from conforming materials and  
supplies and removal of nonconforming subassemblies and parts.  
c. Identification and control of limited-life materials and supplies.  
d. Identification and control of raw materials.  
e. Assurance that the required test reports, certification, etc., have been received.  
f. Clear identification of materials released from receiving inspection and test to clearly indicate acceptance or  
rejection status of material pending review action.  
A.4.8.1.1.13 Schematics. Schematics pertaining to the testing of microcircuits shall be under document control.  
This includes device schematics or burn-in schematics in accordance with the applicable device specification or  
drawing.  
A.4.8.1.1.14 ESD handling control program. The ESD handling control program documentation shall be under  
document control. This includes methods, equipment and materials, training, packaging, handling, and procedures  
for handling ESD sensitive devices.  
A.4.8.1.2 Records to be maintained. The records required by this section shall be continuously maintained during  
the manufacture of microcircuits that are intended to be submitted for quality conformance inspection under this  
specification. The records pertaining to production processes, incoming and in-process inspections shall be retained  
as detailed in A.4.8.1.2.b. Those pertaining to screening and quality conformance inspection shall be retained for a  
minimum of 5 years after performance of the inspections. Records shall be maintained as a minimum for:  
a. Personnel training and testing (see A.4.8.1.2.1) (1-year active file retention; 5-year total record retention).  
b. Inspection operations (see A.4.8.1.2.2) (1-year record retention for production processes, incoming and  
in-process; 5-year record retention for screening, qualification, and quality conformance inspection).  
c. Failure and defect reports and analyses (see A.4.8.1.2.3) (5-year record retention).  
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