MIL-PRF-38535K
APPENDIX A
A.4.8.1.1.6 Design, processing, manufacturing equipment, and materials instructions. Device design, processing,
manufacturing equipment and materials shall be documented in drawings, standards, specifications, or other
appropriate media which shall cover the requirements and tolerances for all aspects of design and manufacture
including equipment test and prove-in, materials acquisition and handling, design-verification testing and processing
steps. As a minimum requirement, detailed documentation shall exist for the following items and shall be adequate to
assure that quantitative controls are exercised, that tolerances or limits of control (limits shall be established for
baselined and other critical wafer fabrication process monitors used for acceptance of class levels B and S product)
are sufficiently tight to assure a reproducible high quality product and that process and inspection records reflect the
results actually achieved:
a. Incoming materials control (wafers, substrates, packages, active and passive chips or elements for hybrid or
multichip microcircuits, wire, water purification, etc.).
b. Masking, photoresist, and mask registration.
c. Epitaxy and diffusion.
d. Oxidation and passivation.
e. Metallization and film deposition.
f. Die, element, and substrate attachment.
g. Bonding.
h. Rework.
i. Sealing.
A.4.8.1.1.7 Cleanliness and atmosphere control in work areas. The requirements for cleanliness and atmosphere
control in each work area in which unsealed devices, or parts thereof, are processed or assembled shall be
documented. During manufacture, transit, and storage, prior to seal, microcircuit die/wafers shall be protected from
human contamination, machine overspray, or other sources of contamination which may occur due to human error or
machine design which does not totally eliminate the possibility of overspray or other forms of contamination. Airborne
particulate class limits shall be as defined by ISO 14644-1. A method for class verification and reverification shall be
documented and implemented. ISO 14644-2 may be used as a guideline. The manufacturer shall establish action
and absolute control limits (at which point work stops until corrective action is completed) based on historical data
and criticality of the process in each particular area. For foreign material identification and control, see internal visual
inspection requirements test method TM 2010 of MIL-STD-883.
A.4.8.1.1.8 Design, material, and process change control. The methods and procedures for implementation and
control of changes in device design, material and processing, and for making change information available to the
acquiring activity, when applicable, shall be documented.
A.4.8.1.1.9 Tool, gauge, and test equipment maintenance and calibration. The maintenance and calibration
procedures, and the frequency of scheduled actions, for tools, gauges, manufacturing and test equipment shall be
documented and in accordance with in-house requirements. ANSI/NCSL Z540.3 or equivalent should be used as a
guideline. Failure to perform scheduled maintenance, repair and recalibration requirements critical to a process (as
defined by the manufacturer) shall require corrective action.
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ACTEL [ Actel Corporation ]
