SMT Footprints
FIGURE A
FIGURE B
Recommended copper heat speader drain pad footprint
Recommended heat sink solder mask opening
1
W
W
2
W
Note:The thickness of
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design limita-
tions and process.
L
L
1.40
(0.060)
0.80
(0.030)
Part Number
“L”
“W1”
“W2”
Part Number
573100
“L”
“W”
573100
573300
573400
9.02 (0.355)
13.72 (0.540)
13.72 (0.540)
13.46 (0.530)
15.75 (0.620)
20.57 (0.810)
8.89 (0.350)
11.18 (0.440)
16.00 (0.630)
9.53 (0.375)
14.22 (0.560)
14.22 (0.560)
13.97 (0.550)
16.26 (0.640)
21.08 (0.830)
573300
573400
FIGURE C
FIGURE D
Recommended copper pad size
for heat sink and device mounting footprint
Recommended copper pad size
for heat sink and device mounting footprint
10.41
(0.410)
20.32
(0.800)
2.54
15.49
(0.610)
2.29
(0.090)
(0.100)
10.67
(0.420)
15.49
2.54
(0.100)
10.67
(0.420)
7.62
(0.300)
(0.610)
16.76
(0.660)
For D Pak (TO-263)
For MO-184 and SO-10
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26
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