SMT
5731 Surface mount heat sink for D-PAK (TO-252) package semiconductors
Air Velocity—Feet Per Minute
0
200
400
600
800
1000
25
8.00
(0.315)
100
80
20
15
10
5
22.86
(0.900)
60
40
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
20
0
10.16
(0.400)
8.13
(0.320)
0
0.0
0.5
1.0
1.5
2.0
2.5
Heat Dissipated—Watts
1.3
(0.05)
10.41
(0.410)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
ORDERING INFORMATION
Part Number
Packaging
573100D00010G 13" Reel, 250 per reel
573100D00000G Bulk, 500 per bag
See page 25 for tape and reel information
5733 Surface mount heat sink for D2 PAK (TO-263) package semiconductors
Air Velocity—Feet Per Minute
0
200
400
600
800
1000
20
12.70
(0.500)
50
40
30
20
16
12
26.16
(1.030)
8
4
0
Surface mount heat sink for D2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
10
0
10.16
(0.400)
7.37
(0.290)
0.0
0.5
1.0
1.5
2.0
2.5
12.70
(0.500)
1.3
(0.05)
Heat Dissipated—Watts
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
ORDERING INFORMATION
Part Number
Packaging
573300D00010G 13" Reel, 250 per reel
573300D00000G Bulk, 500 per bag
See page 25 for tape and reel information
7106 Surface mount heat sink for D2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
5.33
(0.210)
Air Velocity—Feet Per Minute
0
200
400
600
800
1000
10
100
80
10.92
(0.430)
14.99
(0.590)
14.99
(0.590)
8
6
4
2
0
60
Surface mount heat sink for D2 PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
40
25.91
(1.020)
20
0
10.16
(0.400)
0
1
2
3
4
5
Heat Dissipated—Watts
9.52
(0.375)
7.62
(0.300)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
ORDERING INFORMATION
Refer to Figure C on page 26 for board footprint information
Part Number
7106D/TRG
7106DG
Packaging
13" Reel, 200 per reel
Bulk, 500 per bag
See page 25 for tape and reel information
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