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7148DG 参数 Datasheet PDF下载

7148DG图片预览
型号: 7148DG
PDF下载: 下载PDF文件 查看货源
内容描述: 与折叠鳍频道风格散热片 [Channel style heat sink with folded back fins]
分类和应用: 散热片
文件页数/大小: 116 页 / 8734 K
品牌: AAVID [ AAVID THERMALLOY, LLC ]
 浏览型号7148DG的Datasheet PDF文件第20页浏览型号7148DG的Datasheet PDF文件第21页浏览型号7148DG的Datasheet PDF文件第22页浏览型号7148DG的Datasheet PDF文件第23页浏览型号7148DG的Datasheet PDF文件第25页浏览型号7148DG的Datasheet PDF文件第26页浏览型号7148DG的Datasheet PDF文件第27页浏览型号7148DG的Datasheet PDF文件第28页  
SMT  
5731 Surface mount heat sink for D-PAK (TO-252) package semiconductors  
Air VelocityFeet Per Minute  
0
200  
400  
600  
800  
1000  
25  
8.00  
(0.315)  
100  
80  
20  
15  
10  
5
22.86  
(0.900)  
60  
40  
Surface mount heat sink for D-PAK  
(TO-252) package semiconductors  
remove the heat indirectly without  
contacting the device like traditional  
through hole heat sinks. The device  
and the heat sink are soldered directly  
to a modified drain pad creating a  
thermal transfer path from package  
tab to the heat sink.  
20  
0
10.16  
(0.400)  
8.13  
(0.320)  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
Heat DissipatedWatts  
1.3  
(0.05)  
10.41  
(0.410)  
Material: 0.63 (0.025) Thick Copper  
Finish: Tin Plated  
Refer to Figure A and B on page 26 for board footprint information  
ORDERING INFORMATION  
Part Number  
Packaging  
573100D00010G 13" Reel, 250 per reel  
573100D00000G Bulk, 500 per bag  
See page 25 for tape and reel information  
5733 Surface mount heat sink for D2 PAK (TO-263) package semiconductors  
Air VelocityFeet Per Minute  
0
200  
400  
600  
800  
1000  
20  
12.70  
(0.500)  
50  
40  
30  
20  
16  
12  
26.16  
(1.030)  
8
4
0
Surface mount heat sink for D2 PAK  
(TO-263) package semiconductors  
remove the heat indirectly without  
contacting the device like traditional  
through hole heat sinks. The device  
and the heat sink are soldered directly  
to a modified drain pad creating a  
thermal transfer path from package  
tab to the heat sink.  
10  
0
10.16  
(0.400)  
7.37  
(0.290)  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
12.70  
(0.500)  
1.3  
(0.05)  
Heat DissipatedWatts  
Material: 0.63 (0.025) Thick Copper  
Finish: Tin Plated  
Refer to Figure A and B on page 26 for board footprint information  
ORDERING INFORMATION  
Part Number  
Packaging  
573300D00010G 13" Reel, 250 per reel  
573300D00000G Bulk, 500 per bag  
See page 25 for tape and reel information  
7106 Surface mount heat sink for D2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors  
5.33  
(0.210)  
Air VelocityFeet Per Minute  
0
200  
400  
600  
800  
1000  
10  
100  
80  
10.92  
(0.430)  
14.99  
(0.590)  
14.99  
(0.590)  
8
6
4
2
0
60  
Surface mount heat sink for D2 PAK  
(TO-263), power SO-10 (MO-184)  
and SO-10 package semiconductors  
remove the heat indirectly without  
contacting the device like traditional  
through hole heat sinks. The device  
and the heat sink are soldered directly  
to a modified drain pad creating a  
thermal transfer path from package  
tab to the heat sink.  
40  
25.91  
(1.020)  
20  
0
10.16  
(0.400)  
0
1
2
3
4
5
Heat DissipatedWatts  
9.52  
(0.375)  
7.62  
(0.300)  
Material: 0.63 (0.025) Thick Copper  
Finish: Tin Plated  
ORDERING INFORMATION  
Refer to Figure C on page 26 for board footprint information  
Part Number  
7106D/TRG  
7106DG  
Packaging  
13" Reel, 200 per reel  
Bulk, 500 per bag  
See page 25 for tape and reel information  
USA Tel: +1 (603) 224-9988 email: info@aavid.com  
Italy Tel: +39 051 764011 email: sales.it@aavid.com  
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg  
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw  
AMERICA  
EUROPE  
ASIA  
24  
www.aavidthermalloy.com  
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com  
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