H Soldering Specifications:
H2: Classification Reflow Profiles
H1: Classification Reflow Profile for SMT components:
Profile Feature
Pb-Free Assembly
Preheat
- Temperature Min (T
)
150°C
200°C
60-180 seconds
smin
- Temperature Max (T
- Time (t ) from (T
)
smax
to T )
s
smin
smax
Ramp-up rate (T to T )
3°C/ second max.
L
P
Liquidous temperature (T )
217°C
60-150 seconds
L
Time (t ) maintained above T
L
L
Peak package body temperature (T )
p
See Table H3
Time within 5°C of actual peak temperature (t )
p
20-30 seconds
6°C/ second max.
8 minutes max.
Ramp-down rate (T to T )
P
L
Time 25°C to peak temperature
refer to IPC/JEDEC J-STD-020D
H3: Package Classification Reflow Temperature
Package Thickness
Volume mm³
<350
Volume mm³
350 - 2000
Volume mm³
>2000
PB-Free Assembly
PB-Free Assembly
< 1.6 mm
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
1.6 - 2.5 mm
≥ 2.5 mm
PB-Free Assembly
refer to IPC/JEDEC J-STD-020D
DESCRIPTION
WE-SECF SMD EMI Contact Finger
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Order.- No.
SIZE
A4
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
331221602040
Size: 2240
1.0
2012-10-30
DATE
SSt
BY
WJ
REV
CHECKED
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.