The Communications Edge TM
AH103A
High Gain, High Linearity ½-Watt Amplifier
Product Information
AH103A-G (Lead-Free Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260°C reflow temperature) and lead (maximum 245°C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“103AG” designator followed by a alpha-
numeric lot code on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Class 1B
Passes ꢀ500 V to <1000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Standard:
ESD Rating:
Value:
Test:
Class III
Passes ꢀ500 V to <1000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Standard:
MSL Rating:
Standard:
Level 2 at +260 °C convection reflow
JEDEC Standard J-STD-020
Functional Pin Layout
Pin
1
Function
Amp2 input
Mounting Configuration / Land Pattern
2
Amp1 output / Bias Amp1
Ground
3, 5, 8
4
6
7
RF input (Amp1 input)
RF output (Amp2 output)
Bias Amp2
The backside paddle is the Source and should be
grounded for thermal and electrical purposes. All
other pins should be grounded on the PCB.
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
Thermal Specifications
MTTF vs. GND Tab Temperature
1000
100
10
Parameter
Rating
Operating Case Temperature
Thermal Resistance (1), Rth
Junction Temperature (2), Tjc
-40 to +85° C
20.6° C / W
129° C
4. Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground
contacts the heatsink.
/ thermal via region
5. For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
1. The thermal resistance is referenced from the hottest part of the junction to
the ground paddle underneath the device.
2. This corresponds to the typical biasing condition of +4.5V, 75mA on pin 1
and 9V, 200 mA on pins 6, 7 at an 85° C case temperature. A minimum
MTTF of 1 million hours is achieved for junction temperatures below 160° C.
7. Use 1 oz. Copper minimum.
1
8. All dimensions are in millimeters. Angles are in degrees.
9. A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
60
70
80
90
100 110 120
Tab Temperature (°C)
Specifications and information are subject to change without notice
Page 6 of 6 March 2005
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
WJCI [ WJ COMMUNICATION. INC. ]
