WFY3P02 参数 Datasheet PDF下载

WFY3P02

−20V,

P−Channel MOSFET

,

Features

■

-3.2A, -20V, R

DS(on)

(Max 130mΩ)@V

GS

=-4.5V

■ −1.8

V Rated for Low Voltage Gate Drive

■

SOT-23 Surface Mount for Small Footprint

■

Single Pulse Avalanche Energy Rated

General Description

This Power MOSFET is produced using Winsemi’s advanced

MOS technology. This latest technology has been especially

designed to minimize on-state resistance, have a high rugged

avalanche characteristics. This devices is specially well suited for

Load/Power Management for Portables and Computing,

Charging Circuits and Battery Protection

G

S

D

SOT-23

Marking: H03F

Absolute Maximum Ratings

Symbol

V

DSS

I

D

Drain Source Voltage

Continuous Drain Current(Note 1)

Steady State

t≤10s

Steady State

t≤10s

Steady State

t=10s

C=100pF,R

S

= 1500Ω

Tc=25℃

Tc=85℃

Tc=25℃

Tc=25℃

Tc=25℃

Tc=85℃

Tc=25℃

Parameter

Value

-20

−2.8

-1.7

-3.2

0.80

1.25

-1.8

-1.3

0.42

-7.5

±8

225

-55~150

260

Units

V

A

P

D

I

D

P

D

I

DM

V

GS

ESD

T

J,

T

stg

T

L

Total Power Dissipation(Note 1)

Continuous Drain Current(Note 2)

Total Power Dissipation(Note 2)

Drain Current Pulsed

Gate to Source Voltage

ESD Capability (Note 3)

Junction and Storage Temperature

W

A

W

A

V

V

℃

℃

Maximum lead Temperature for soldering purposes

Maximum ratings are those values beyond which device damage can occur.Maximum ratings applied to the device are

individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded,

device functional operation is not implied, damage may occur and reliability may be affected.

Thermal Characteristics

Symbol

R

QJA

R

QJA

R

QJA

Parameter

Thermal Resistance, Junction-to-Ambient(Note 1)

Thermal Resistance, Junction-to-Ambient(Note 1)

Thermal Resistance, Junction-to-Ambient(Note 2)

Value

Min

-

Typ

-

Max

170

110

300

Units

℃/W

℃/W

℃/W

Note 1: Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces)

Note 2: Surface−mounted on FR4 board using the minimum recommended pad size.

Note 3: ESD Rating Information: HBM Class 0

Rev. A Mar.2010-H03F

Copyright@WinSemi Semiconductor Co.,Ltd.,All rights reserved.

P03-3