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ISD17180EYR 参数 Datasheet PDF下载

ISD17180EYR图片预览
型号: ISD17180EYR
PDF下载: 下载PDF文件 查看货源
内容描述: 多信息单芯片语音记录和回放设备 [Multi-Message Single-Chip Voice Record & Playback Devices]
分类和应用:
文件页数/大小: 24 页 / 351 K
品牌: WINBOND [ WINBOND ]
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ISD1700 SERIES  
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment  
intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation  
instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or  
sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could  
result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.  
Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully  
indemnify Winbond for any damages resulting from such improper use or sales.  
The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no  
representation or warranties with respect to the accuracy or completeness of the contents of this publication and  
reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.  
No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this  
publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability  
whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or  
infringement of any Intellectual property.  
The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any  
express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual  
property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for  
loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this  
documents, even if Winbond has been advised of the possibility of such damages.  
Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only  
and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.  
The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in  
the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates  
SuperFlash®.  
This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder®  
product specifications. In the event any inconsistencies exist between the information in this and other product  
documentation, or in the event that other product documentation contains information in addition to the information in  
this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is  
subject to change without notice.  
Copyright© 2005, Winbond Electronics Corporation. All rights reserved. ChipCorder® and ISD® are trademarks of  
Winbond Electronics Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All other trademarks  
are properties of their respective owners.  
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