ISD1700 SERIES
Example #3: Connecting the SPI Interface to a microcontroller
Reset
3
2
24
23
25
REC
RESET
PLAY
ERASE
0.1μF
vAlert
D1
1 KΩ
LED
26
FWD
Vcc
Gnd
**
VCCD
**
19
22
VCCA
VCCD
VCCP
VOL
FT
1
VCCD
VSSD
0.1
μ
F
*
28
VCCA
21
8
VCCA
VSSA
7
6
*
μ
0.1
F
SS
VCCP
SCLK
MOSI
MISO
14
16
VCCP
To uC
SPI
5
4
*
ISD1700
*
VSSP1
μ
0.1
F
μ
0.1
F
12
VSSP2
15
13
10
11
Speaker
or Buzzer
VCC
SP+
SP-
MIC+
MIC -
Speaker
AUD
AUX
17
27
0.1μF
9
AUD/AUX
INT/RDY
8050C
AnaIn
VCCD
100 KΩ
Optional
Rosc ***
390
Ω
20
18
F
ROSC
AGC
0.1μ F
μ
4.7
Optional: based upon the applications
*** At 8kHz sampling freq, Rosc = 80 K
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
10.1
GOOD AUDIO DESIGN PRACTICES
To ensure the highest quality of voice reproduction, it is important to follow good audio design
practices in layout and power supply decoupling. See recommendations from below links or other
Application Notes in our websites.
Design Considerations for ISD1700 Family
AN-CC1002 Design Considerations for ISD1700 Family.pdf
Good Audio Design Practices
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf
Single-Chip Board Layout Diagrams
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf
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