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I1610P 参数 Datasheet PDF下载

I1610P图片预览
型号: I1610P
PDF下载: 下载PDF文件 查看货源
内容描述: [Speech Synthesizer With RCDG, 20s, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16]
分类和应用: 光电二极管商用集成电路
文件页数/大小: 22 页 / 330 K
品牌: WINBOND [ WINBOND ]
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ISD1600 SERIES
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 5
6. PIN DESCRIPTION ............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION............................................................................................................ 8
7.1. Detailed Description
.................................................................................................................. 8
8. TIMING DIAGRAMS.......................................................................................................................... 10
9. ABSOLUTE MAXIMUM RATINGS
[1]
................................................................................................ 12
9.1 Operating Conditions
............................................................................................................... 13
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 14
10.1. DC Parameters
...................................................................................................................... 14
10.2. AC Parameters
...................................................................................................................... 15
11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 16
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 17
12.1. 16-Lead 150mil Small Outline IC (SOIC) Package
.......................................................... 17
12.2. 16-Lead 300mil Plastic Dual Inline Package (PDIP)
....................................................... 18
12.3. Die Physical Layout
.............................................................................................................. 19
13. ORDERING INFORMATION........................................................................................................... 20
14. VERSION HISTORY ....................................................................................................................... 21
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