CG6263AM 参数 Datasheet PDF下载

PRELIMINARY

Pin Configuration

FBGA

Top View

1

BLE

I/O

8

I/O

9

V

SS

V

CC

I/O

14

I/O

15

NC/

A

18

2

OE

BHE

I/O

10

I/O

11

3

A

0

A

3

A

5

NC

4

A

1

A

4

A

6

A

7

A

16

A

15

A

13

A

10

5

A

2

CE

I/O

1

I/O

3

I/O

4

I/O

5

WE

A

11

6

NC

I/O

0

I/O

2

Vcc

Vss

I/O

6

I/O

7

NC/

A

20

A

B

C

D

E

F

G

H

CG6263AM

I/O

12

GND

I/O

13

NC/

A

19

A

8

A

14

A

12

A

9

Note:

2. DNU pins have to be left floating.

3. Ball D3, H1, G2 and ball H6 for the FBGA package can be used to upgrade to a 4M, 8M, 16M and a 32M density respectively.

4. NC “no connect” - not connected internally to the die.

38-XXXXX

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