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V23990-P760-AY-PM 参数 Datasheet PDF下载

V23990-P760-AY-PM图片预览
型号: V23990-P760-AY-PM
PDF下载: 下载PDF文件 查看货源
内容描述: [Very Compact housing, easy to route]
分类和应用:
文件页数/大小: 24 页 / 1222 K
品牌: VINCOTECH [ VINCOTECH ]
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V23990-P760-A-PM  
V23990-P760-AY-PM  
datasheet  
Characteristic Values  
Conditions  
Value  
Typ  
Parameter  
Symbol  
Unit  
Vr [V] or IC [A] or  
VCE [V] or IF [A] or  
DS [V] D [A]  
VGE [V] or  
Tj  
Min  
Max  
V
GS [V]  
V
I
Brake IGBT  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
5
5,8  
6,5  
2,3  
VGE(th) VCE=VGE  
Gate emitter threshold voltage  
Collectorꢀemitter saturation voltage  
Collectorꢀemitter cutꢀoff incl diode  
Gateꢀemitter leakage current  
Integrated Gate resistor  
Turnꢀon delay time  
0,0017  
50  
V
V
1,84  
2,27  
VCE(sat)  
ICES  
15  
0
0,25  
700  
1200  
0
mA  
nA  
IGES  
Rgint  
td(on)  
tr  
20  
4
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
117  
121  
18  
Rise time  
24  
ns  
249  
316  
88  
125  
2,39  
3,43  
2,96  
4,8  
td(off)  
Turnꢀoff delay time  
Rgoff=8 ꢂ  
±15  
600  
50  
Rgon=8 ꢂ  
tf  
Fall time  
Eon  
Eoff  
Cies  
Turnꢀon energy loss per pulse  
Turnꢀoff energy loss per pulse  
Input capacitance  
mWs  
pF  
2770  
205  
160  
290  
0,6  
Coss  
Crss  
Output capacitance  
f=1MHz  
0
25  
Tj=25°C  
Tj=25°C  
Reverse transfer capacitance  
Gate charge  
QGate  
RthJH  
RthJC  
±15  
960  
nC  
Thermal grease  
thickness≤50µm  
λ = 0,61 W/mꢁK  
Thermal resistance chip to heatsink  
Thermal resistance chip to case  
K/W  
0,39  
Brake Inverse Diode  
Tj=25°C  
Tj=150°C  
1,1  
1,84  
1,8  
2,1  
VF  
Diode forward voltage  
10  
V
Thermal grease  
thickness≤50µm  
λ = 0,61 W/mꢁK  
RthJH  
RthJC  
Thermal resistance chip to heatsink  
Thermal resistance chip to case  
1,81  
1,20  
K/W  
K/W  
Brake FWD  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
1,87  
1,83  
2,2  
10  
VF  
Ir  
Diode forward voltage  
25  
50  
V
ꢃA  
Reverse leakage current  
Peak reverse recovery current  
Reverse recovery time  
±15  
±15  
600  
600  
54,29  
78,18  
158,7  
295,4  
3,21  
6,6  
4114  
3412  
3,21  
6,6  
IRRM  
trr  
A
ns  
Qrr  
µC  
Reverse recovered charge  
Peak rate of fall of recovery current  
Reverse recovery energy  
Thermal resistance chip to heatsink  
Thermal resistance chip to case  
Rgon=8 ꢂ  
50  
di(rec)max  
/dt  
A/µs  
mWs  
Erec  
RthJH  
RthJC  
Thermal grease  
thickness≤50µm  
λ = 0,61 W/mꢁK  
1,27  
K/W  
0,84  
Thermistor  
R25  
Rated resistance  
Deviation of R100  
Power dissipation given EpcosꢀTyp  
Bꢀvalue  
Tol. ±5%  
Tj=25°C  
Tc=100°C  
Tj=25°C  
Tj=25°C  
20,9  
22  
2,9  
23,1  
kꢂ  
%/K  
mW  
K
DR/R  
R100=1486.1ꢂ  
P
210  
4000  
B(25/100)  
Tol. ±3%  
copyright Vincotech  
5
21 Jan. 2015 / Revision: 5