D/CRCW e3
Vishay
Standard Thick Film Chip Resistors
TEST PROCEDURES AND REQUIREMENTS
IEC
60068-2
TEST
METHOD
REQUIREMENTS
PERMISSIBLE CHANGE (R)
TEST
PROCEDURE
STABILITY
CLASS 1
OR BETTER
Stability for product types:
D/CRCW e3
4.5
4.7
4.13
-
-
-
Resistance
Voltage proof
Short time overload
-
U
= 1.4 x
U
ins
; 60 s
U
= 2.5 x
P
70
x
R
2 x
U
max.
;
duration: Acc. to style
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5)
C
(3 ± 0.3) s
(20/- 55/20)
C
and
(20/125/20)
C
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
Depth 2 mm;
3 times
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles
1000 cycles
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
-
125 °C; 16 h
55 °C;
90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH;
24 h; 5 cycles
U
=
P
70
x
R
U
=
P
70
x
R
U
max.
;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (2 %
R
+ 0.1
)
± (4 %
R
+ 0.1
)
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (0.25 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
±1%
No flashover or breakdown
±0.25 %
R
+ 0.05)
±0.5 %
R
+ 0.05)
1
to 10 M
±5%
SIZE 0402 to 2512
STABILITY
CLASS 2
OR BETTER
EN
60115-1
CLAUSE
Good tinning ( 95 % covered)
no visible damage
4.17.2
58 (Td)
Solderability
Good tinning ( 95 % covered)
no visible damage
4.8.4.2
4.32
4.33
-
21 (Uu
3
)
21 (Uu
1
)
Temperature
coefficient
Shear
(adhesion)
Substrate bending
± 100 ppm/K
No visible damage
± 200 ppm/K
No visible damage, no open circuit in bent position
± (0.25 %
R
+ 0.05
)
4.19
14 (Na)
Rapid change of
temperature
4.25.1
-
Endurance
at 70 °C
Document Number: 20035
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For technical questions, contact:
thickfilmchip@vishay.com
130
Revision: 04-Jun-12
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