D/CRCW e3
Vishay
Standard Thick Film Chip Resistors
FEATURES
Stability
R/R
= 1 % for 1000 h at 70 ° C
2 mm pitch packaging option for 0603 size
Pure tin solder contacts on Ni barrier layer
provides compatibility with lead (Pb)-free and lead
containing soldering processes
Metal glaze on high quality ceramic
AEC-Q200 qualified
Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
SIZE
MODEL
INCH
METRIC
RATED
DISSIPATION
P
70 °C
W
0.063
LIMITING
ELEMENT TEMPERATURE TOLERANCE RESISTANCE
RANGE
COEFFICIENT
%
VOLTAGE
ppm/K
U
max.
AC/DC
50
± 100
± 200
±1
±5
1R0 to 10M
SERIES
E24; E96
E24
D10/CRCW0402
0402
RR 1005M
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 1.5 A
D11/CRCW0603
0603
RR 1608M
0.10
75
± 100
± 200
± 100
± 200
±1
±5
±1
±5
1R0 to 10M
E24; E96
E24
E24; E96
E24
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 2.0 A
D12/CRCW0805
0805
RR 2012M
0.125
150
1R0 to 10M
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 2.5 A
D25/CRCW1206
1206
RR 3216M
0.25
200
± 100
± 200
±1
±5
1R0 to 10M
E24; E96
E24
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 3.5 A
CRCW1210
1210
RR 3225M
0.5
200
± 100
± 200
± 100
± 200
±1
±5
±1
±5
1R0 to 10M
E24; E96
E24
E24; E96
E24
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 5.0 A
CRCW1218
1218
RR 3246M
1.0
200
1R0 to 2M2
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 7.0 A
CRCW2010
2010
RR 5025M
0.75
400
± 100
± 200
± 100
± 200
±1
±5
±1
±5
1R0 to 10M
E24; E96
E24
E24; E96
E24
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 6.0 A
CRCW2512
2512
RR 6332M
1.0
500
1R0 to 10M
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 7.0 A
Notes
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
Marking: See data sheet “Surface Mount Resistor Marking” (document number 20020).
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
www.vishay.com
Document Number: 20035
For technical questions, contact:
thickfilmchip@vishay.com
Revision: 04-Jun-12
125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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