SPECIFICATIONS (CONT.)
General
Parameter
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals
Mechanical
Weight
Dimensions
Length
Width
Height
Thermal
Over temperature shutdown
Operating temperature - heatsink
Junction-to-heatsink thermal impedance (R
θJC
)
Heatsink to ambient thermal impedance (R
θHA
)
0.50
5.95
125
3.2/92
3.54/ 89,9
0.56/ 14,2
1.13/ 28,7
130
3.55/ 90,1
0.57/ 14,6
1.18/ 30,0
135
100
0.65
6.10
oz /g
in / mm
in / mm
in / mm
°C
°C
°C/ W
°C/ W
Junction temperature
See thermal curve, Figure 1
Heatsink temperature measured
in location shown in Figure 2
Refer to
4,242
1,000
10
cTÜVus
CE Mark
Min
Typ
3.5
Max
Unit
Mhrs
Vdc
pF
MΩ
Note
25°C, GB
Input to Output
Input to Output
Input to Output
UL /CSA 60950-1, EN 60950-1
Low Voltage Directive
See Mechanical Drawings
Auxiliary Pins
Parameter
(Conditions are at 350 Vin, full load, and 25°C ambient unless otherwise specified)
Min
4.8
2.4
2.4
Typ
5.0
2.5
2.5
2.5
160
20
Max
5.2
2.6
2.9
Unit
Vdc
Vdc
Vdc
mA
ms
µs
Note
Enable / Disable (CNTRL)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Enable delay time
Disable delay time
Source only
Time from PC low to output low
VI BRICK BCM Array
BC352R110T060VM-00
vicorpower.com
Rev. 1.0
Page 3 of 6
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