PRELIMINARY
V•I Chip Bus Converter Module
Configuration Options
Configuration
Inboard(1)
(Package K)
Onboard(1)
(Package F)
Inboard with 0.25"
Pin Fins(2)
Onboard with 0.25"
Pin Fins(2)
Effective power density
1400 W/in3
2.1 °C/W
1.1 °C/W
880 W/in3
2.4 °C/W
1.1 °C/W
550 W/in3
2.1 °C/W
N/A
440 W/in3
2.4 °C/W
N/A
Junction-Board
thermal resistance
Junction-Case
thermal resistance
Junction-Ambient
thermal resistance 300LFM
6.5 °C/W
6.8 °C/W
5.0 °C/W
5.0 °C/W
Notes:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
(2) Pin Fin heat sink available as a separate item
21.5
0.85
22.0
0.87
32.0
1.26
32.0
1.26
4.0
0.16
6.3
0.25
ONBOARD MOUNT
INBOARD MOUNT
(V•I Chip recessed into PCB)
mm
in
mm
in
Figure 19—Inboard mounting – package K
Figure 20— Onboard mounting – package F
Input reflected ripple
measurement point
F1
7 A
Fuse
+Out
+In
+
Enable/Disable Switch
R3
10 mΩ
-Out
C1
100 µF
electrolytic
TM
RSV
PC
BCM
R2
typ.
Load
–
2K Ω
C3
10 µF
+Out
D1
SW1
K
-In
Ro
-Out
Notes:
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a seperate damping resistor.
D1 power good indicator will dim when a module fault is detected.
Figure 21—BCM test circuit
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K060T24
Rev. 1.0
Page 10 of 15
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