CHA6005-QEG
8-12GHz High Power Amplifier
Package Outline (1)
Matt tin, Lead Free
Units :
(Green)
1- Nc
2- Nc
13- VD2
14- Nc
mm
From the standard :
JEDEC MO-220
(VGHD)
3- Nc
15- Gnd (2)
4- Nc
16- Nc
25- GND
5- Nc
17- VD1
18- VG1
19- Nc
6- Nc
7- Nc
8- Nc
20- Nc
9- Gnd (2)
10- RF OUT
11- Gnd (2)
12- Nc
21- Gnd (2)
22- RF IN
23- Gnd (2)
24- Nc
(1) The package outline drawing included to this data-sheet is given for indication. Refer to the
application note AN0017 (http://www.ums-gaas.com) for exact package dimensions.
(2) It is strongly recommended to ground all pins marked “Gnd”ꢀ throughꢀ theꢀ PCBꢀ board.ꢀ
Ensure that the PCB board is designed to provide the best possible ground to the package.
Ref. : DSCHA6005-QEG5070 – 11 Mar 15
8/12
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
