23-34GHz High Power Amplifier
CHA4042
MMIC Outline & Bond Pads
Not to scale, dimensions are in millimeters
1.090
14
12 11
13
10
9
.467
.338
.000
15
1
.240
8
2
3
4
5
6
7
Bond Pad #1, 7, 9: GND
Bond Pad #4, 5, 11: GND
Bond Pad #14: GND
Bond Pad #2: VG1
Bond Pad #3: VG2
Bond Pad #6: VG3
Bond Pad #8: RF OUT
Bond Pad #10: VD3
Bond Pad #12: VD2
Bond Pad #13: VD1
Bond Pad #15: RF IN
(0.080 x 0.080)
(0.080 x 0.090)
(0.122 x 0.080)
(0.100 x 0.150)
(0.100 x 0.150)
(0.100 x 0.100)
(0.100 x 0.260)
(0.100 x 0.100)
(0.100 x 0.100)
(0.100 x 0.100)
(0.100 x 0.200)
Units: millimeters
Thickness: 0.070
Chip size : 1930µm +/-35µm x 1090µm +/- 35µm
Ref. : DSCHA40422218 -06-Aug.-02
4/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
