36-40GHz Low Noise Amplifier
Chip Assembly and Mechanical Data
100pF
CHA2094b
To Vdd DC Drain supply feed
IN
OUT
100pF
100pF
To Vgs 1&2 DC Gate supply feed
To Vgs 3 DC Gate supply feed
Note : Supply feed should be capacitively bypassed.
1720 10
±
1125
505
1080 10
±
415
340
415
710
Bonding pad positions.
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHA20949312 – 08-Nov.-99
7/8
Specifications subject to change without notice
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Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09