DS_8014R_012
73S8014R Data Sheet
2.3 Package Thermal Parameters
Table 4 lists the 73S8014R Smart Card interface requirements.
Table 4: Package Thermal Parameters
Rating
50 °C / W
Parameter
20 SO
2.4 Smart Card Interface Requirements
Table 5 lists the 73S8014R Smart Card interface requirements.
Table 5: DC Smart Card Interface Requirements
Condition Min
Symbol
Card Power Supply (VCC) Regulator
General conditions, -40°C < T < 85°C, 4.75V < VPC < 5.5V, 2.7V < VDD < 5.5V
Parameter
Nom
Max
Unit
Inactive mode
-0.1
-0.1
4.65
2.85
1.68
0.1
0.4
V
V
V
V
V
Inactive mode, ICC = 1mA
Active mode; ICC <65mA; 5V
Active mode; ICC <65mA; 3V
Active mode; ICC <40mA; 1.8V
5.25
3.15
1.92
Card supply voltage
including ripple and
noise
Active mode; single pulse of 100mA for
4.6
5.25
3.2
V
V
VCC
2μs; 5 volt, fixed load = 25mA
Active mode; single pulse of 100mA for
2.76
2μs; 3v, fixed load = 25mA
Active mode; current pulses of 40nAs
with peak |ICC | <200mA,
4.6
2.7
5.25
V
V
t <400ns; 5V
Active mode; current pulses of 40nAs
with peak |ICC | <200mA,
3.15
350
t <400ns; 3V
VCCrip
ICCmax
ICCF
VCC Ripple
fRIPPLE = 20K – 200MHz
mV
mA
Card supply output
current
Static load current, VCC>4.6V or 2.7V
as selected
65
70
ICC fault current
130
mA
VSR
VSF
VCC slew rate, rise
VCC slew rate, fall
0.06
0.150
0.150
0.30
0.60
CF = 1.0μF on VCC
CF = 1.0μF on VCC
V/μs
V/μs
0.075
CF should be ceramic with low ESR
(<100mΩ).
External filter cap
(VCC to GND)
CF
0.5
1.0
1.5
μF
Rev. 1.0
9
TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
