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73S8009R-IL/F 参数 Datasheet PDF下载

73S8009R-IL/F图片预览
型号: 73S8009R-IL/F
PDF下载: 下载PDF文件 查看货源
内容描述: 低成本通用智能卡接口 [Low Cost Versatile Smart Card Interface]
分类和应用: 模拟IC信号电路光电二极管PC
文件页数/大小: 23 页 / 337 K
品牌: TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
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DS_8009R_056  
73S8009R Data Sheet  
Table of Contents  
1
2
Pinout.............................................................................................................................................5  
Electrical Specifications................................................................................................................8  
2.1 Absolute Maximum Ratings.....................................................................................................8  
2.2 Recommended Operating Conditions......................................................................................8  
2.3 Smart Card Interface Requirements ........................................................................................9  
2.4 Digital Signals Characteristics ...............................................................................................11  
2.5 DC Characteristics ................................................................................................................11  
2.6 Voltage / Temperature Fault Detection Circuits......................................................................12  
3
Applications Information.............................................................................................................13  
3.1 Example 73S8009R Schematics ...........................................................................................13  
3.2 System Controller Interface ...................................................................................................14  
3.3 Power Supply and Voltage Supervision .................................................................................14  
3.4 Card Power Supply...............................................................................................................14  
3.5 Over-temperature Monitor .....................................................................................................15  
3.6 Activation and Deactivation Sequence...................................................................................15  
3.7 OFF and Fault Detection.......................................................................................................16  
3.8 Power-down Operation..........................................................................................................17  
3.9 Chip Select ...........................................................................................................................18  
3.10 I/O Circuitry and Timing.........................................................................................................18  
4
Mechanical Drawings ..................................................................................................................20  
4.1 20-pin QFN...........................................................................................................................20  
4.2 28-Pin SO.............................................................................................................................21  
5
6
7
Ordering Information...................................................................................................................22  
Related Documentation...............................................................................................................22  
Contact Information.....................................................................................................................22  
Revision History ..................................................................................................................................23  
Rev. 1.3  
3