High Frequency Chip Inductor
L1M SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
1.50
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
0.40
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for re-flow
soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If Use Wave soldering is there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be unwitting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.3 Soldering Iron :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4~5sec.
a) Preheat circuit and products to 150° C.
b) 350° C tip temperature (max)
c) Never contact the ceramic with the iron tip
Preheating
Soldering
Natural
cooling
Preheating
Soldering
20~40s
Natural
cooling
Within 4-5s
350
150
TP(260° C/40s max.)
217
200
150
60~150s
60~180s
480s max.
25
Gradual
Cooling
Over 1min.
Time(sec.)
Figure 1. Re-flow Soldering : 3 times max
Figure 2. Iron Soldering times：1 times max
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
10.11.2011
PG. 7
SUPERWORLD ELECTRONICS (S) PTE LTD
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
