High Frequency Chip Inductor
L1M SERIES
7. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Agilent E4991
Agilent4287
Agilent16192
Refer to standard electrical characteristics list
Inductance(Ls)
Q Factor
DC Resistance
Agilent 4338
Rated Current
DC Power Supply
Over Rated Current requirements, therewill besomerisk
Rated Current < 1A ΔT 20°C Max
Rated Current ≧ 1A ΔT 40°C Max
1. Applied the allowedDC current.
Temperature RiseTest
Solder Heat Resistance
2. Temperature measured by digital surfacethermometer.
Preheat : 150° C,60sec.
Solder : Sn-Cu0.5
No mechanical damage.
Remaining terminal electrode : 75% min.
Solder Temperature : 260± 5° C
Flux for lead free:ROL0
Dip Time : 10±0.5sec.
Preheating Dipping Natural
cooling
260° C
150° C
60
seconds
10± 0.5
seconds
Preheat : 150° C,60sec.
Solder : Sn-Cu0.5
Solderability
More than 95% of the terminal electrode
should be covered withsolder.
Solder Temperature : 245± 5° C
Flux for lead free:ROL0
Dip Time : 4± 1sec.
Preheating Dipping Natural
cooling
245° C
150° C
60
seconds
4± 1.0
seconds
Terminal Strength
The terminal electrode & thedielectric must
not be damaged by the forces appliedonthe
right conditions.
For L Series :
Size
1
Force (Kfg)
0.2
Time (sec)
2
0.5
3
0.6
W
4
1.0
> 30
5
1.0
6
1.0
7
1.5
Flexture Strength
The terminal electrode & thedielectric must
not be damaged by the forces appliedonthe
right conditions.
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
The duration of the applied forces shall be60
(+ 5) Sec.
20(.787)
Bending
45(1.772) 45(1.772)
40(1.575)
100(3.937)
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
10.11.2011
PG. 5
SUPERWORLD ELECTRONICS (S) PTE LTD
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
