S93WD462/S93WD463
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ....................................................................................................................................–55°C to +125°C
Storage Temperature .........................................................................................................................................–65°C to +150°C
Voltage on any Pin with Respect to Ground(1) .............................................................................................–2.0V to +VCC +2.0V
VCC with Respect to Ground .................................................................................................................................. –2.0V to +7.0V
Package Power Dissipation Capability (Ta = 25°C) ............................................................................................................. 1.0W
Lead Soldering Temperature (10 secs) .............................................................................................................................. 300°C
Output Short Circuit Current(2) ...........................................................................................................................................100 mA
*COMMENT
Stressesabovethoselistedunder“AbsoluteMaximumRatings”maycausepermanentdamagetothedevice.Thesearestressratingsonly,andfunctional
operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to
any absolute maximum rating for extended periods may affect device performance and reliability.
RECOMMENDED OPERATING CONDITIONS
Temperature
Commercial
Industrial
Min
0°C
Max
+70°C
+85°C
-40°C
2029 PGM T7.0
RELIABILITY CHARACTERISTICS
Symbol
Parameter
Endurance
Min.
1,000,000
100
Max.
Units
Cycles/Byte
Years
Reference Test Method
MIL-STD-883, Test Method 1033
MIL-STD-883, Test Method 1008
MIL-STD-883, Test Method 3015
JEDEC Standard 17
(3)
NEND
(3)
TDR
Data Retention
ESD Susceptibility
Latch-Up
(3)
VZAP
2000
Volts
(3)(4)
ILTH
100
mA
2029 PGM T2.1
D.C. OPERATING CHARACTERISTICS (over recommended operating conditions unless otherwise specified)
Limits
Symbol
Parameter
Min.
Typ.
Max.
Units
Test Conditions
ICC
Power Supply Current
(Operating)
3
mA
DI = 0.0V, fSK = 1MHz
VCC = 5.0V, CS = 5.0V,
Output Open
ISB
Power Supply Current
(Standby)
50
µA
CS = 0V
Reset Outputs Open
ILI
Input Leakage Current
2
µA
µA
VIN = 0V to VCC
ILO
Output Leakage Current
(Including ORG pin)
10
VOUT = 0V to VCC
CS = 0V
,
VIL1
VIH1
Input Low Voltage
Input High Voltage
-0.1
2
0.8
V
V
4.5V≤VCC<5.5V
1.8V≤VCC<2.7V
VCC+1
VIL2
VIH2
Input Low Voltage
Input High Voltage
0
VCCX0.2
VCC+1
V
V
VCCX0.7
VOL1
VOH1
Output Low Voltage
Output High Voltage
0.4
V
V
4.5V≤VCC<5.5V
IOL = 2.1mA
IOH = -400µA
2.4
VOL2
VOH2
Output Low Voltage
Output High Voltage
0.2
V
V
1.8V≤VCC<2.7V
IOL = 1mA
IOH = -100µA
VCC-0.2
2029 PGM T3.0
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is V +0.5V, which may overshoot to V +2.0V for periods of less than 20 ns.
CC
CC
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to V +1V.
CC
2029-01 4/14/98
7
SUMMIT [ SUMMIT MICROELECTRONICS, INC. ]
