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MGN1105MS-TR 参数 Datasheet PDF下载

MGN1105MS-TR图片预览
型号: MGN1105MS-TR
PDF下载: 下载PDF文件 查看货源
内容描述: [Lead–free soldering compatible]
分类和应用:
文件页数/大小: 25 页 / 729 K
品牌: STANLEY [ STANLEY ELECTRIC CO.,LTD. ]
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Soldering Condition  
MGN1105MS-TR  
Soldering Precaution】  
(acc.to EIAJ-4701/300)  
1. Heat stress during soldering will influence the reliability of LEDs, however that effect will vary on heating  
method. Also, if components of varying shape are soldered together, it is recommended to set the soldering  
pad temperature according to the component most vulnerable to heat (e.g., surface mount LED).  
2. The LEDs constituent parts, including the resin, do not stabilize immediately after soldering. Any  
mechanical stress may cause damage to the products. Please avoid stacking the PCBs, or any other storage  
method which may cause the PCBs to bend; also, prevent contact of LED with any materials.  
3. The recommended temperature profile for reflow soldering is listed as the top surface temperature. This is  
due to the fact that temperature distribution varies on heating method, PCB material, other components in  
the assembly, and concentration of the parts mounted. Typically, when FR-4 PCB is mounted with one  
single LED and heated via Far infrared and hot air, the difference in temperature between PCB and LED  
resin will be around 5-10°C. Please do not repeat the heating process during reflow more than two times.  
Recommended Reflow Soldering Condition】  
Peak Temperature  
(Soldering)  
260MAX.  
+1.5+5/s  
-1.5-5/s  
230MAX.  
90~120sec MAX.  
Pre-heating)  
150180℃  
40sec MAX.  
Note 1 Recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface.  
This should be the maximum temperature for soldering. Lowering the heating temperature and decreasing heating  
time is very effective in achieving higher reliability.  
Note 2 The reflow soldering process should be done up to twice(2 times Max). When second process is  
performed, interval between first and second process should be as short as possible to prevent absorption of  
moisture to resin of LED. The second soldering process should not be done until LEDs have returned to room  
temperature (by nature-cooling) after first soldering process.  
Page : 8  
2017.4.26