Soldering Condition
MGN1105MS-TR
【Soldering Precaution】
(acc.to EIAJ-4701/300)
1. Heat stress during soldering will influence the reliability of LEDs, however that effect will vary on heating
method. Also, if components of varying shape are soldered together, it is recommended to set the soldering
pad temperature according to the component most vulnerable to heat (e.g., surface mount LED).
2. The LEDs constituent parts, including the resin, do not stabilize immediately after soldering. Any
mechanical stress may cause damage to the products. Please avoid stacking the PCBs, or any other storage
method which may cause the PCBs to bend; also, prevent contact of LED with any materials.
3. The recommended temperature profile for reflow soldering is listed as the top surface temperature. This is
due to the fact that temperature distribution varies on heating method, PCB material, other components in
the assembly, and concentration of the parts mounted. Typically, when FR-4 PCB is mounted with one
single LED and heated via Far infrared and hot air, the difference in temperature between PCB and LED
resin will be around 5-10°C. Please do not repeat the heating process during reflow more than two times.
【Recommended Reflow Soldering Condition】
Peak Temperature
(Soldering)
260℃ MAX.
+1.5~+5℃/s
-1.5~-5℃/s
230℃ MAX.
90~120sec MAX.
(Pre-heating)
150℃~180℃
40sec MAX.
Note 1 Recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface.
This should be the maximum temperature for soldering. Lowering the heating temperature and decreasing heating
time is very effective in achieving higher reliability.
Note 2 The reflow soldering process should be done up to twice(2 times Max). When second process is
performed, interval between first and second process should be as short as possible to prevent absorption of
moisture to resin of LED. The second soldering process should not be done until LEDs have returned to room
temperature (by nature-cooling) after first soldering process.
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2017.4.26