Preliminary
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3 Electrical Characteristics
3.1 Test Conditions
3.1.1 Typical Values
The typical data are based on TAMB=25°C and VDD=3.0 V, as defined in Table 3.2 (p. 8), by simu-
lation and/or technology characterisation unless otherwise specified.
3.1.2 Minimum and Maximum Values
The minimum and maximum values represent the worst conditions of ambient temperature, supply volt-
age and frequencies, as defined in Table 3.2 (p. 8), by simulation and/or technology characterisa-
tion unless otherwise specified.
3.2 Absolute Maximum Ratings
The absolute maximum ratings are stress ratings, and functional operation under such conditions are
not guaranteed. Stress beyond the limits specified in Table 3.1 (p. 8) may affect the device reliability
or cause permanent damage to the device. Functional operating conditions are given in Table 3.2 (p.
8) .
Table 3.1. Absolute Maximum Ratings
Symbol
Parameter
Condition
Min
Typ
Max
Unit
1501 °C
TSTG
Storage tempera-
ture range
-40
TS
Maximum soldering Latest IPC/JEDEC J-STD-020
260 °C
temperature
Standard
VDDMAX
External main sup-
ply voltage
0
3.8
V
V
VIOPIN
Voltage on any I/O
pin
-0.3
VDD+0.3
1Based on programmed devices tested for 10000 hours at 150ºC. Storage temperature affects retention of preprogrammed cal-
ibration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data re-
tention for different temperatures.
3.3 General Operating Conditions
3.3.1 General Operating Conditions
Table 3.2. General Operating Conditions
Symbol
TAMB
VDDOP
fAPB
Parameter
Min
Typ
Max
Unit
85 °C
3.8
Ambient temperature range
Operating supply voltage
Internal APB clock frequency
Internal AHB clock frequency
-40
1.85
V
24 MHz
24 MHz
fAHB
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2013-10-09 - EFM32ZG210FXX - d0065_Rev0.60
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