SAW FILTER
HDIF45A10Dc SIP5Dc
Temperature
+25 ℃=>-40 ℃ 0.5h
-40 ℃ 4h
-40 ℃=>+85 ℃ 2h
+85 ℃ 4h
+85 ℃=>+25 ℃ 0.5h
+25 ℃ 1h
Duration
1
2
3
4
5
6
Resistance to Reflow soldering method
Soldering
heat
Peak: 255 ±5 ℃, 220±5 ℃, 40s
At electrode temperature of the specimen.
The specimen shall be passed through the reflow
furnace with the condition shown in the above
profile for 1 time.
The specimen shall be stored at standard
atmospheric conditions for 1h, after which the
measurement shall be made. Test board shall be
1.6 mm thick. Base material shall be glass fabric
base epoxy resin.
Solder ability Immerse the pins melt solder at 260℃+5/-0℃ More then 95% of
for 5 sec.
total area of the
pins should be
covered with solder
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