ULTRA FAST RECOVERY
POWER RECTIFIER
1N6627D3A / 1N6627D3B
MECHANICAL DATA
A
DLCC3 Variant A (D3A)
D
PAD 1
PAD 2
ANODE
CATHODE
SML
D3A
DIMENSION
mm
Inches
A
B
C
D
7.00 0.10
3.75 0.10
1.60 0.10
1.76 0.10
0.275 0.004
0.143 0.004
0.063 0.004
0.069 0.004
C
1
C
2
A
D
DLCC3 Variant B (D3B)
PAD 1
PAD 2
PAD 3
ANODE
CATHODE
LID CONTACT TO CATHODE*
SML
D3B
DIMENSION
mm
Inches
C
1
C
A
B
C
D
7.00 0.10
3.75 0.10
1.60 0.10
1.76 0.10
0.275 0.004
0.143 0.004
0.063 0.004
0.069 0.004
2
3
* The additional contact provides a connection to the lid in the application. Connecting the metal lid to a known electrical potential stops deep
dielectric discharge in space applications; see the Space Weather link www.semelab.co.uk/dlcc3.html on the Semelab web site. Package variant
to be specified at order.
† The DLCC3 package design takes full advantage of the proven high reliability pedigree of the HTCC surface mount packaging technology,
which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture
and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications.
SOLDER PAD LAYOUT
mm
7.32
1.78
3.94
Inches
0.288
0.070
0.155
A
B
The physical dimensions for the DLCC3 ceramic package are designed
to be different from the published dimensions for the “D-5B” and “E-
MELF” outlines. The DLCC3 design fully utilises the recommended
solder footprint for the “D-5B” / “E-MELF” Package, and as such
presents a drop in replacement for existing board designs.
C
Soldering temperature should be 260°C for a
maximum of 10 seconds.
PACKAGE MASS
Gold Plated Solder Pad Finish = 150mg
Semelab ltd
Telephone +44 (0) 1455 556565
Email: sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website: http://www.semelab-tt.com
Document Number 9028
Issue 2
Page 3 of 4
SEME-LAB [ SEME LAB ]
