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SS1636 参数 Datasheet PDF下载

SS1636图片预览
型号: SS1636
PDF下载: 下载PDF文件 查看货源
内容描述: [Unipolar Hall Switch-High sensitivity]
分类和应用:
文件页数/大小: 5 页 / 261 K
品牌: SECELECTRONICS [ SEC Electronics Inc. ]
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SS1636  
Unipolar Hall Switch-High sensitivity  
General Description  
The SS1636 Hall effect sensor IC is fabricated from mixed signal CMOS technology. It incorporates advanced  
chopper-stabilization techniques to provide accurate and stable magnetic switch points.  
The circuit design provides an internally controlled clocking mechanism to cycle power to the Hall element and  
analog signal processing circuits. This serves to place the high current-consuming portions of the circuit into a  
“Sleep” mode. Periodically the device is “Awakened” by this internal logic and the magnetic flux from the Hall  
element is evaluated against the predefined thresholds. If the flux density is above or below the Bop/Brp thresholds  
then the output transistor is driven to change states accordingly. While in the “Sleep” cycle the output transistor is  
latched in its previous state. The design has been optimized for service in applications requiring extended operating  
lifetime in battery powered systems.  
Pin Definitions and Descriptions  
TSOT Pin № SIP Pin № Name  
Type  
Function  
1
2
3
1
3
2
VDD  
Supply  
Output  
Ground  
Supply Voltage pin  
Open Drain Output pin  
Ground pin  
OUT  
GND  
Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Units  
V
Supply Voltage  
Supply Current  
Output Voltage  
Output Current  
VDD  
IDD  
5.5  
70  
μA  
V
VOUT  
IOUT  
5.5  
5
mA  
°C  
°C  
V
Operating Temperature Range TA  
-40 to 150  
-65 to 170  
4000  
Storage Temperature Range  
ESD Sensitivity  
TS  
Operating Temperature Range Symbol  
Value  
Units  
Temperature Suffix “E”  
Temperature Suffix “K”  
Temperature Suffix “L”  
TA  
TA  
TA  
-40 to 85  
-40 to 125  
-40 to 150  
°C  
°C  
°C  
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-rated conditions for extended  
periods may affect device reliability.  
2
V3.10 Nov 1, 2013