ADV Sensors
Package Drawings and Specifications
MSOP8 (ADV001-00E)
.118
(3.00)
.118 (3.00)
NVE
XXX
.118 (3.00)
.193 (4.90)
.021 (.533)
.154 (3.91)
.012 TYP.
.034 (.86)
.040 (1.02)
Dimensions: inches (mm)
.0256 (.65) X 6
.004 (.102) min
.012 (.305) max
Notes:
1. The MSOP8 package has thermal power dissipation of 320°C/Watt in free air.
2. Thermal performance is improved when the package is soldered to a circuit board.
2.5 mm x 2.5 mm TDFN6 (ADV001-10E)
dimensions in mm
Notes:
1. The TDFN6 package has thermal power dissipation of 320°C/Watt in free air.
2. Thermal performance is improved when the package is soldered to a circuit board.
SB-00-016
June 2008
- 3 -
www.rhopointcomponents.com
RHOPOINT [ RHOPOINT COMPONENTS ]
