LYT2002-2005
Absolute Maximum Ratings(1,6)
DRAIN Voltage .........................................................-0.3 V to 725 V Notes:
DRAIN Pin Peak Current(5): LYT2002 ......................... 504 (750) mA(2) 1. All voltages referenced to SOURCE, TA = 25 °C.
LYT2003 ......................... 654 (980) mA(2) 2. Higher peak Drain current allowed while Drain to Source
LYT2004........................686 (1029) mA(2)
voltage does not exceed 400 V.
LYT2005 ........................784 (1176) mA(2) 3. Duration not to exceed 2 ms.
Peak Negative Pulsed Drain Current.................................. -100 mA(3) 4. Normally limited by internal circuitry.
FEEDBACK Pin Voltage ................................................... -0.3 to 9 V 5. 1/16 in. from case for 5 seconds.
FEEDBACK Pin Current .........................................................100 mA 6. Absolute Maximum Ratings specified may be applied, one
BYPASS Pin Voltage ........................................................ -0.3 to 9 V
Storage Temperature ................................................. -65 to 150 °C
Operating Junction Temperature(4) ...............................-40 to 150 °C
Lead Temperature(5) ..............................................................260 °C
at a time without causing permanent damage to the
product. Exposure to Absolute Maximum Ratings for
extended periods of time may affect product reliability.
Thermal Resistance
Thermal Resistance: D Package:
Notes:
(qJA) ......................................100 °C/W(2), 80 °C/W(3) 1. Measured on pin 8 (SOURCE) close to plastic interface.
(qJC)(1) .........................................................30 °C/W 2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.
3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
4. Free standing with no heat sink.
5. Measured at the back surface of tab.
6. Soldered (including exposed pad for K package) to typical
application PCB with a heat sinking area of 0.36 sq. in.
(232 mm2), 2 oz. (610 g/m2) copper clad.
7. Soldered (including exposed pad for K package) to typical
application PCB with a heat sinking area of 1 sq. in. (645 mm2),
2 oz. (610 g/m2) copper clad.
E Package
(qJA).............................................. 105 °C/W(4)
(qJC)..................................................2 °C/W(5)
K Package
(qJA) ..............................45 °C/W(6), 38 °C/W(7)
(qJC)..................................................2 °C/W(5)
Conditions
SOURCE = 0 V; TJ = 0 to 100 °C
(Unless Otherwise Specified)
Parameter
Symbol
Min
Typ
Max
Units
Control Functions
TJ = 25 °C
tON × IFB = 1.4 mA-ms
Programmable
Maximum Frequency
fOSC
VFB = VFBth
85
kHz
Hz
See Note A
LYT2002-2003
LYT2004
300
775
510
330
850
580
365
930
645
Minimum Operation
Frequency
TJ = 25 °C
VFB = VFBth
fOSC(MIN)
LYT2005
Frequency Ratio
(Constant Current)
TJ = 25 °C
Between VFB = 1.0 V and VFB = 1.6 V
fRATIO(CC)
1.550
1.160
1.593
1.210
±7
1.635
1.260
Frequency Ratio
(Inductance
Correction)
Between tON × IFB = 1.4 mA and
tON × IFB = 2 mA-ms
fRATIO(IC)
Peak-to-Peak Jitter Compared to Average
Frequency, TJ = 25 °C
Frequency Jitter
%
8
Rev. B 09/15
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