OXFORD SEMICONDUCTOR LTD.
8.3.7
8.3.8
8.3.9
8.3.10
8.3.11
OXmPCI952
ECP DATA FIFO ........................................................................................................................................................... 76
TEST FIFO .................................................................................................................................................................... 76
CONFIGURATION A REGISTER ................................................................................................................................. 76
CONFIGURATION B REGISTER ................................................................................................................................. 76
EXTENDED CONTROL REGISTER ‘ECR’................................................................................................................... 77
SPECIFICATION ............................................................................................................................................................... 78
ZONE 0: HEADER ........................................................................................................................................................ 79
ZONE 1: LOCAL CONFIGURATION REGISTERS....................................................................................................... 80
ZONE 2: IDENTIFICATION REGISTERS ..................................................................................................................... 81
ZONE 3: PCI CONFIGURATION REGISTERS ............................................................................................................ 81
ZONE 4 : POWER MANAGEMENT DATA
(AND DATA_SCALE ZONE) ............................................................. 82
ZONE 5 : FUNCTION ACCESS .................................................................................................................................... 82
MINIMUM PROGRAMMING REQUIREMENTS. .......................................................................................................... 83
9
9.1
9.1.1
9.1.2
9.1.3
9.1.4
9.1.5
9.1.6
9.1.7
SERIAL EEPROM................................................................................................................................ 78
10
11
10.1
11.1
11.2
11.3
OPERATING CONDITIONS ............................................................................................................. 84
DC ELECTRICAL CHARACTERISTICS .......................................................................................................................... 84
AC ELECTRICAL CHARACTERISTICS.......................................................................................... 86
PCI BUS ............................................................................................................................................................................ 86
LOCAL BUS...................................................................................................................................................................... 86
SERIAL PORTS ................................................................................................................................................................ 88
12
13
13.1
13.2
TIMING WAVEFORMS..................................................................................................................... 89
PACKAGE INFORMATION............................................................................................................ 104
160-PIN LQFP PACKAGE .............................................................................................................................................. 104
176-PIN BGA PACKAGE................................................................................................................................................ 105
14
ORDERING INFORMATION .......................................................................................................... 106
DS-0020 Jun 05
Page 5
OXFORD [ OXFORD SEMICONDUCTOR ]
