High Frequency Ceramic Solutions
P/N: 0896BM15A0032
Sub-GHz Impedance Matched Balun + LPF integrated Passive Component
for Microchip SAM R30
1/27/2017
Detail Specification:
Page 4 of 4
Application Notes, Layout Files, and more
http://www.johansontechnology.com/microchip
Packaging information
Soldering Information
MSL Info
www.johansontechnology.com/tape-reel-packaging
www.johansontechnology.com/ipcsoldering-profile
www.johansontechnology.com/msl-rating
Recommended Storage Condition and Max Shelf Life
www.johansontechnology.com/recommended-storage-conditions
RoHS Compliance
www.johansontechnology.com/rohs-compliance
Antenna layout and tuning techniques
www.johansontechnology.com/tuning
Antenna layout review, tuning, and characterization services
www.johansontechnology.com/ipc-antenna-services
Johanson Technology, Inc. reserves the right to make design changes without notice.
All sales are subject to Johanson Technology, Inc. terms and conditions.
www.johansontechnology.com
4001 Calle Tecate • Camarillo, CA 93012, USA • TEL +1.805.389.1166
2017 Johanson Technology, Inc. All Rights Reserved
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JOHANSON [ JOHANSON TECHNOLOGY INC. ]
