High Frequency Ceramic Solutions
P/N: 0896BM15A0032
Sub-GHz Impedance Matched Balun + LPF integrated Passive Component
for Microchip SAM R30
1/27/2017
Detail Specification:
Page 2 of 4
Mounting Considerations
0.3
0.35
*Line width should be designed to match 50Ω
characteristic impedance, depending on PCB
material and thickness.
1.0
Vias are important
for proper
harmonic
GND
Footprint
0.8
GND Vias (φ 0.35/φ 0.2)
2.0
Would you like us to provide the layout files of the
Microchip chipset + 2450BM15A0032? Review your layout
for free? Please go to this link to contact our RF team:
www.johansontechnology.com/ask-a-question
"Applications Engineering" on the drop down question
type
*
Units in mm
Do you need the layout/gerber files of the above? Go to: www.johansontechnology.com/microchip or send us
message to review your layout at: http://www.johansontechnology.com/ask-a-question
Measuring Diagram
Port 1:Unbalanced Port
Ports 2 and 3: Balanced Port
IL=Sds21
Port 2*
Port 3*
Network Analyzer
Port 1(50 Ω)
RL=Sss11
Amp_balance = dB(S(2,1)/S(3,1))
Phase_balance = Phase(S(2,1)/S(3,1))
GND
GND
*Impedance for ports 2 and 3
= Conjugate to Balanced Impedance/2
GND
You can download the s-parameters at: http://www.johansontechnology.com/microchip
Johanson Technology, Inc. reserves the right to make design changes without notice.
All sales are subject to Johanson Technology, Inc. terms and conditions.
www.johansontechnology.com
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Ver 1.0
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