ESMT
M52D128168A (2E)
Operation Temperature Condition -40°C~85°C
SIMPLIFIED TRUTH TABLE
A11,
A9~A0
BA0
BA1
COMMAND
CKEn-1 CKEn
DQM
X
Note
CS RAS CAS WE
A10/AP
Mode Register set
Register
Refresh
H
H
X
L
L
L
L
L
L
L
OP CODE
X
1,2
Extended Mode Register
set
Auto Refresh
H
L
3
3
3
3
H
X
Entry
Self
L
H
L
H
X
L
H
X
H
H
X
H
X
X
X
Refresh
Exit
L
H
X
X
Bank Active & Row Addr.
H
V
V
Row Address
Column
Address
(A0~A8)
Column
Address
(A0~A8)
Auto Precharge Disable
Auto Precharge Enable
Auto Precharge Disable
Auto Precharge Enable
L
H
L
4
4,5
4
Read &
H
H
X
X
L
L
H
H
L
L
H
L
X
X
Column Address
Write &
V
Column Address
H
4,5
6
Burst Stop
Precharge
H
H
X
X
L
L
H
L
H
H
L
L
X
X
X
Bank Selection
All Banks
V
X
L
X
H
H
L
X
H
X
X
H
X
X
H
X
Entry
H
L
X
Clock Suspend or
X
X
Active Power Down Mode
Exit
L
H
L
X
X
X
H
L
X
H
X
H
X
X
H
X
H
X
H
X
H
X
H
Entry
H
Precharge Power Down Mode
H
L
Exit
L
H
H
H
X
X
V
X
DQM
X
X
7
H
L
L
X
H
H
X
H
L
No Operating Command
Entry
Exit
H
L
L
H
X
X
X
Deep Power Down Mode
X
H
X
X
X
(V = Valid, X = Don’t Care. H = Logic High, L = Logic Low)
Note:
1.OP Code: Operating Code
A0~A11 & BA0~BA1: Program keys. (@ MRS). BA1=0 for MRS and BA1=1 for EMRS
2.MRS/EMRS can be issued only at all banks precharge state.
A new command can be issued after 2 CLK cycles of MRS/EMRS.
3.Auto refresh functions are as same as CBR refresh of DRAM.
The automatical precharge without row precharge of command is meant by “Auto”.
Auto/self refresh can be issued only at all banks idle state.
4.BA0~BA1: Bank select addresses.
If both BA0 and BA1 are “Low” at read, write, row active and precharge, bank A is selected.
If both BA0 is “Low” and BA1 is “High” at read, write, row active and precharge, bank B is selected.
If both BA0 is “High” and BA1 is “Low” at read, write, row active and precharge, bank C is selected.
If both BA0 and BA1 are “High” at read, write, row active and precharge, bank D is selected
If A10/AP is “High” at row precharge, BA0 and BA1 is ignored and all banks are selected.
5.During burst read or write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after the end of burst.
6.Burst stop command is valid at every burst length.
7.DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (write DQM latency is 0), but
makes Hi-Z state the data-out of 2 CLK cycles after.(Read DQM latency is 2)
Elite Semiconductor Memory Technology Inc.
Publication Date: Jan. 2016
Revision: 1.1 7/47
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
