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M24L16161ZA 参数 Datasheet PDF下载

M24L16161ZA图片预览
型号: M24L16161ZA
PDF下载: 下载PDF文件 查看货源
内容描述: 16兆位( 1M ×16 )伪静态RAM [16-Mbit (1M x 16) Pseudo Static RAM]
分类和应用:
文件页数/大小: 15 页 / 379 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M24L16161ZA  
Switching Characteristics Over the Operating Range [12, 13, 14, 15, 18]  
-70  
Parameter  
Read Cycle  
Description  
Unit  
Min.  
Max.  
tRC[17]  
tCD  
Read Cycle Time  
Chip Deselect Time  
70  
15  
40000  
ns  
ns  
CE , BLE /BHE High Pulse Time  
Address to Data Valid  
Data Hold from Address Change  
tAA  
tOHA  
tACE  
70  
ns  
ns  
ns  
5
70  
35  
CE LOW to Data Valid  
tDOE  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
OE LOW to Data Valid  
tLZOE  
tHZOE  
tLZCE  
tHZCE  
tDBE  
5
OE LOW to Low Z[13, 14, 16]  
OE HIGH to High Z[13, 14, 16]  
CE LOW to Low Z[13, 14, 16]  
CE HIGH to High Z[13, 14, 16]  
BLE /BHE LOW to Data Valid  
BLE /BHE LOW to Low Z[13, 14, 16]  
BLE /BHE HIGH to High Z[13, 14, 16]  
25  
10  
25  
70  
tLZBE  
tHZBE  
5
25  
Write Cycle[15]  
tWC  
Write Cycle Time  
70  
60  
60  
40000  
ns  
ns  
tSCE  
tAW  
CE LOW to Write End  
Address Set-Up to Write End  
ns  
ns  
Chip Deselect Time CE , BLE / BHE High Pulse  
Time  
tCD  
15  
tHA  
tSA  
tPWE  
Address Hold from Write End  
Address Set-Up to Write Start  
0
0
50  
ns  
ns  
ns  
WE Pulse Width  
tBW  
60  
ns  
BLE /BHE LOW to Write End  
Data Set-Up to Write End  
Data Hold from Write End  
tSD  
tHD  
tHZWE  
25  
0
ns  
ns  
ns  
25  
WE LOW to High-Z[13, 14, 16]  
WE HIGH to Low-Z[13, 14, 16]  
tLZWE  
10  
ns  
Notes:  
12. Test conditions for all parameters other than tri-state parameters assume signal transition time of 1 ns/V, timing reference  
levels of VCC/2, input pulse levels of 0V to VCC, and output loading of the specified IOL/IOH as shown in the “AC Test Loads and  
Waveforms” section.  
13. At any given temperature and voltage conditions tHZCE is less than tLZCE, tHZBE is less than tLZBE, tHZOE is less than tLZOE, and  
tHZWE is less than tLZWE for any given device. All low-Z parameters will be measured with a load capacitance of 30 pF (3V).  
14. tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high-impedance state.  
15. The internal Write time of the memory is defined by the overlap of WE , CE = VIL, BHE and/or BLE = VIL. All signals  
must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up  
and hold timing should be referenced to the edge of the signal that terminates the write.  
16. High-Z and Low-Z parameters are characterized and are not 100% tested.  
17. If invalid address signals shorter than min. tRC are continuously repeated for 40 µs, the device needs a normal read timing  
(tRC) or needs to enter standby state at least once in every 40 µs.18.In order to achieve 70-ns performance, the read access  
must be CE controlled. That is, the addresses must be stable prior to CE going active.  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jul. 2007  
Revision : 1.0 9/15